IBM System x3550 M3 User Manual

IBM System x3550 M3 28
See the IBM ServerProven® website for the latest information about the specific versions and service
levels supported and any other prerequisites:
http://www.ibm.com/systems/info/x86servers/serverproven/compat/us/nos/matrix.shtml
Physical and electrical specifications
Dimensions:
Height: 43 mm (1.7 in)

Width: 440 mm (17.3 in)

Depth: 711 mm (28.0 in)

Weight:

Minimum configuration 12.7 kg (28 lb)

Maximum configuration 15.9 kg (35.1 lb)
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Supported environment:
Air temperature:

Server on: 10 to 35° C (50.0 to 95.0° F); altitude: 0 to 914.4 m (3,000 ft).

Decrease system temperature by 0.75° C for every 1,000-foot increase in altitude.

Server off: 5 to 45° C (41.0 to 113° F);

Shipment: -40 to +60° C (-40 to 140° F);

Humidity:

Server on: 20 to 80% , maximum dew point 21° C, maximum rate of change 5° C/hr

Server off: 8 to 80%, maximum dew point 27° C

Electrical:
Models with 675 W power supply

100 to 127 (nominal) V ac; 50 Hz or 60 Hz; 7.8 A

200 to 240 (nominal) V ac; 50 Hz or 60 Hz; 3.8 A

Input kilovolt-amperes (kVA) (approximately):

Minimum configuration: 0.12 kVA

Maximum configuration: 0.78 kVA

Models with 460 W power supply

100 to 127 (nominal) V ac; 50 Hz or 60 Hz; 5.3 A

200 to 240 (nominal) V ac; 50 Hz or 60 Hz; 2.6 A

Input kilovolt-amperes (kVA) (approximately):

Minimum configuration: 0.12 kVA

Maximum configuration: 0.53 kVA

BTU heat output:
Minimum configuration: 307 Btu/hr (90 watts)

Maximum configuration: 2660 Btu/hr (780 watts)

Acoustical noise level emission level:
6.1 bels (idling)

6.1 bels (operating)


IBM System x3550 M3 Specifications

General

Tcase	77.6 °C
Bus type	QPI
Stepping	B1
FSB Parity	No
Processor code	SLBV4
Processor cache	12 MB
Processor cores	4
Processor model	E5620
System bus rate	5.86 GT/s
Processor series	Intel Xeon 5600 Series
Processor socket	Socket B (LGA 1366)
Processor threads	8
Processor codename	Westmere EP
Processor frequency	2.4 GHz
Processor cache type	Smart Cache
Processor lithography	32 nm
Processor manufacturer	Intel
Processor package size	42.5 X 45 mm
Processor front side bus	- MHz
Processor boost frequency	2.66 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
Supported instruction sets	SSE4.2
Thermal Design Power (TDP)	80 W
Number of processors installed	2
CPU multiplier (bus/core ratio)	18
Physical Address Extension (PAE)	40 bit
Memory types supported by processor	DDR3 800/1066
Memory channels supported by processor	Triple
Memory clock speeds supported by processor	800, 1066 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	288 GB
HDD size	2.5 \
RAID levels	0, 1, 10
HDD interface	Serial Attached SCSI (SAS)
Optical drive type	-
Total storage capacity	0 GB
Maximum storage capacity	8 TB
Number of HDDs installed	0
Internal memory	24 GB
Internal memory type	DDR3-SDRAM
Maximum internal memory	192 GB
Memory layout (slots x size)	6 x 4 GB
Maximum graphics card memory	16 MB
Graphics card family	Matrox
Graphics card memory type	GDDR2
Cabling technology	10/100/1000Base-T(X)
Ethernet interface type	Gigabit Ethernet
Serial ports quantity	1
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Ethernet LAN (RJ-45) ports	3
Power supply	460 W
Power supply type	AC
Power requirements	100 - 240 V
Power supply input frequency	50 - 60 Hz
Compatible operating systems	Microsoft Windows Server 2008 R2 and 2008, Red Hat Enterprise Linux, SUSE Linux Enterprise Server and VMware ESXi, Oracle Solaris 10 (model dependent)
Storage temperature (T-T)	-40 - 60 °C
Operating temperature (T-T)	10 - 35 °C
Storage relative humidity (H-H)	8 - 80 %
Chassis type	Rack (1U)
Processor ARK ID	47925
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Depth	711 mm
Width	440 mm
Height	43 mm
Weight	15600 g