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IBM System x3550 M3 User Manual

IBM System x3550 M3
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IBM System x3550 M3 7
Standard specifications
Table 1. Standard specifications (part 1)
Components Specification
Form factor 1U Rack.
Processor Up to two six-core (up to 3.46 GHz) or quad-core (up to 3.6 GHz) Intel Xeon 5600 series
processors with QuickPath Interconnect technology up to 6.4 GT/s, and up to 1333 MHz
memory speed.
Memory cache Up to 12 MB L3.
Chipset Intel 5520.
Memory Up to 18 DIMM sockets (9 DIMMs per processor). Up to 288 GB with 16 GB DDR3 RDIMMs
and 18 populated DIMM slots (up to 144 GB with 9 DIMMs per processor), or up to 48 GB with
4 GB DDR3 UDIMMs and 12 populated DIMM slots (up to 24 GB with 6 DIMMs per
processor).
Memory
protection
ECC, ChipKill (for x4-based memory DIMMs), Memory Mirroring, and Memory Sparing.
Disk drive bays Up to eight 2.5" hot-swap SAS/SATA HDDs or solid-state drives (SSDs).
Maximum
internal storage
Up to 7.2 TB with 900 GB SAS HDDs, or up to 8.0 TB with 1 TB SATA HDDs, or up to 1.6 TB
with
200 GB SSDs. Intermix of SAS/SATA/SSD is supported.
RAID Support RAID 0, 1, 1E with ServeRAID-BR10il v2 or M1015; RAID 0, 1, 5, 10, 50
with M
5014 or
M5015. Optional upgrade to RAID 5 is available for M1015. Optional upgrade to RAID 6, 60 is
available for M5014/M5015.
Optical drive
bays
One with optional Optical Drive Enablement Kit, support for DVD-ROM or Multiburner. If used,
the maximum number of HDD bays is limited to 4.
Tape drive bays None.
Network
interfaces
Integrated 2 Gigabit Ethernet ports, plus 2 ports on optional Gigabit Ethernet with Ethernet
Daughter Card (does not consume PCI slot).
PCI Expansion
slots
Up to 3 slots (up to 2 standard slots are available; one slot is dedicated to RAID controller),
dependant on the riser cards used. Standard models have:
Slot 1: PCI Express 2.0 x16, Low-profile
Slot 2: PCI Express 2.0 x16, full-height, half-length
Each slot is implemented using a riser card. Each PCIe riser card can be replaced with a
PCI-X riser card offering one PCI-X 64-bit/133 MHz slot.
External ports Two USB 2.0 and one DB-15 video on front. Two USB 2.0, one DB-15 video, one DB-9 serial,
one RJ-45 systems management, up to 4 RJ-45 Gigabit Ethernet network ports (2 standard, 2
optional) on rear. One internal USB port for embedded hypervisor.
Cooling IBM Calibrated Vectored Cooling™ with 6 counter-rotating hot swap fans with N+1
redundancy. Altimeter is to control fan speed based on atmospheric pressure.
Power supply Up to 2 redundant hot-swap 460 W AC or 675 W AC or 675 W high efficiency (HE) AC power
supplies with 90%+ efficiency. 675 W -48 V DC models are available via CTO.
Hot-swap
components
Hard drives, power supplies, fans.

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IBM System x3550 M3 Specifications

General IconGeneral
Tcase77.6 °C
Bus typeQPI
SteppingB1
FSB ParityNo
Processor codeSLBV4
Processor cache12 MB
Processor cores4
Processor modelE5620
System bus rate5.86 GT/s
Processor seriesIntel Xeon 5600 Series
Processor socketSocket B (LGA 1366)
Processor threads8
Processor codenameWestmere EP
Processor frequency2.4 GHz
Processor cache typeSmart Cache
Processor lithography32 nm
Processor manufacturerIntel
Processor package size42.5 X 45 mm
Processor front side bus- MHz
Processor boost frequency2.66 GHz
Processor operating modes64-bit
ECC supported by processorYes
Supported instruction setsSSE4.2
Thermal Design Power (TDP)80 W
Number of processors installed2
CPU multiplier (bus/core ratio)18
Physical Address Extension (PAE)40 bit
Memory types supported by processorDDR3 800/1066
Memory channels supported by processorTriple
Memory clock speeds supported by processor800, 1066 MHz
Memory bandwidth supported by processor (max)25.6 GB/s
Maximum internal memory supported by processor288 GB
HDD size2.5 \
RAID levels0, 1, 10
HDD interfaceSerial Attached SCSI (SAS)
Optical drive type-
Total storage capacity0 GB
Maximum storage capacity8 TB
Number of HDDs installed0
Internal memory24 GB
Internal memory typeDDR3-SDRAM
Maximum internal memory192 GB
Memory layout (slots x size)6 x 4 GB
Maximum graphics card memory16 MB
Graphics card familyMatrox
Graphics card memory typeGDDR2
Cabling technology10/100/1000Base-T(X)
Ethernet interface typeGigabit Ethernet
Serial ports quantity1
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Ethernet LAN (RJ-45) ports3
Power supply460 W
Power supply typeAC
Power requirements100 - 240 V
Power supply input frequency50 - 60 Hz
Compatible operating systemsMicrosoft Windows Server 2008 R2 and 2008, Red Hat Enterprise Linux, SUSE Linux Enterprise Server and VMware ESXi, Oracle Solaris 10 (model dependent)
Storage temperature (T-T)-40 - 60 °C
Operating temperature (T-T)10 - 35 °C
Storage relative humidity (H-H)8 - 80 %
Chassis typeRack (1U)
Processor ARK ID47925
Intel® Turbo Boost Technology1.0
Weight and Dimensions IconWeight and Dimensions
Depth711 mm
Width440 mm
Height43 mm
Weight15600 g

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