Intel CELERON 1.10 GHZ User Manual

Intel
®
Celeron
®
Processor up to 1.10 GHz
8 Datasheet
32 AGTL+ Signal Groups Ringback Tolerance Specifications at the
Processor Pins (For FC-PGA/FC-PGA2 Packages) ...........................................55
33 AGTL+ Signal Groups Ringback Tolerance Guidelines for Edge Finger
Measurement on the S.E.P. Package.................................................................56
34 Signal Ringback Specifications for Non-AGTL+ Signal Simulation at the
Processor Core (S.E.P. and PPGA Packages)...................................................58
35 Signal Ringback Guidelines for Non-AGTL+ Signal Edge Finger
Measurement (S.E.P. Package)..........................................................................58
36 Signal Ringback Specifications for Non-AGTL+ Signal Simulation at the
Processor Pins (FC-PGA/FC-PGA2 Packages)..................................................58
37 Example Platform Information.............................................................................61
38 66 MHz AGTL+ Signal Group Overshoot/Undershoot Tolerance at
Processor Pins (FC-PGA/FC-PGA2 Packages)..................................................62
39 33 MHz CMOS Signal Group Overshoot/Undershoot Tolerance at
Processor Pins (FC-PGA/FC-PGA2 Packages)..................................................63
40 Processor Power for the PPGA and FC-PGA Packages ....................................66
41 Intel
®
Celeron
®
Processor for the FC-PGA2 Package Thermal Design Power .67
42 Thermal Diode Parameters (S.E.P. and PPGA Packages).................................68
43 Thermal Diode Parameters (FC-PGA/FC-PGA2 Packages)...............................68
44 Thermal Diode Interface......................................................................................68
45 S.E.P. Package Signal Listing by Pin Number....................................................71
46 S.E.P. Package Signal Listing by Signal Name ..................................................75
47 Package Dimensions (PPGA Package)..............................................................80
48 Information Summary (PPGA Package) .............................................................80
49 PPGA Package Signal Listing by Pin Number ....................................................82
50 PPGA Package Signal Listing in Order by Signal Name ....................................87
51 Package Dimensions (FC-PGA Package) ..........................................................93
52 Processor Die Loading Parameters (FC-PGA Package) ....................................93
53 Package Dimensions (FC-PGA2 Package) ........................................................95
54 Processor Case Loading Parameters (FC-PGA2 Package) ...............................95
55 FC-PGA/FC-PGA2 Signal Listing in Order by Signal Name ...............................98
56 FC-PGA/FC-PGA2 Signal Listing in Order by Pin Number...............................103
57 Boxed Processor Fan Heatsink Spatial Dimensions for the S.E.P. Package ...112
58 Fan Heatsink Power and Signal Specifications.................................................118
59 Alphabetical Signal Reference..........................................................................120
60 Output Signals...................................................................................................126
61 Input Signals .....................................................................................................127
62 Input/Output Signals (Single Driver)..................................................................128
63 Input/Output Signals (Multiple Driver) ...............................................................128

Intel CELERON 1.10 GHZ Specifications

General

Brand	Intel
Model	CELERON 1.10 GHZ
Category	Computer Hardware
Language	English