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Intel E7500 User Manual
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Packaging Tec
hnology
R
12
Intel
®
E7500/E7505 Chipset MCH Thermal Design Guide
Figure 3. M
CH Package Dimensions (
Top View
)
AN
AM
AL
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
E
C
B
A
10
16
20
3
5
7
9
11
13
15
19
4
6
18
8
12
14
22
21
24
23
26
25
28
27
30
29
31
32
(n)x 0
.025 Min
Metal Edge
(n)x
∅
0.790 ± 0.025
Solder Resist
Opening
(n)x 0.650 ± 0.040
Detail A
∅
∅
∅
∅
00.071 L C
∅
∅
∅
∅
00.200 L C
A S B
33
1
2
1.270
20.320
40.640
2x 42.500 ±0.
100
0.200 A B
1.2
70
21.
250
Detail A
MCH_Pkg_TopView
17
NOT
ES:
1.
All dimensions ar
e in millimeters.
2.
All dim
ensions
and tolerances
conform
to ANSI
Y14.5M–1982.
11
13
Table of Contents
Default Chapter
3
Table of Contents
3
1 Introduction
7
Design Flow
8
Figure 1. Thermal Design Process
8
Definition of Terms
9
Reference Documents
10
2 Packaging Technology
11
Figure 2. MCH Package Dimensions (Side View)
11
Figure 3. MCH Package Dimensions (Top View)
12
3 Thermal Simulation
13
4 Thermal Specifications
15
Case Temperature and Thermal Design Power
15
Die Temperature
15
Table 1. Intel ® E7500 Chipset MCH Thermal Specifications
15
Table 2. Intel ® E7505 Chipset MCH Thermal Specifications
15
5 Thermal Metrology
17
Die Temperature Measurements
17
0° Angle Attach Methodology
17
Figure 4. 0 Angle Attach Methodology (Top View)
18
Figure 5. 0° Angle Attach Heatsink Modifications
18
Power Simulation Software
19
Figure 6. Thermal Solution Decision Flowchart
19
6 Reference Thermal Solutions
21
Operating Environment
21
Mechanical Design Envelope
21
Figure 7. Reference Heatsink Volumetric Envelope for the MCH
22
Thermal Solution Assembly
23
Figure 8. Reference Thermal Solution Assembly
23
Figure 10. Reference Thermal Solution (Top View)
24
Figure 9. Reference Thermal Solution Assembly (Side View)
24
Figure 11. Preferred Heatsink Orientation
25
Heatsink Orientations
25
Extruded Heatsink Profiles
26
Figure 12. Extruded Heatsink Profile
26
Figure 13. Alternate Tall Heatsink Profile
26
Figure 14. Heatsink Mechanical Gasket, Optional Two-Piece
27
Heatsink Clip
27
Mechanical Interface Material
27
Thermal Interface Material
27
Board Level Component Keep-Out Dimensions
28
Clip Retention Anchors
28
Figure 15. Heatsink Retention Mechanism Layout
28
Figure 16. Retention Mechanism Component Keep-Out Zones
29
Reliability Guidelines
30
Table 3. Reliability Guidelines
30
Appendix A: Thermal Solution Component Suppliers
31
Table 4. Complete Thermal Solution Kits
31
Table 5. Extruded Heatsinks
31
Table 6. Interface Materials
32
Table 7. Attach Hardware
32
Appendix B: Mechanical Drawings
33
Figure 17. MCH Heatsink Assembly
34
Figure 18. MCH Heatsink Clip
35
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Intel E7500 Specifications
General
Brand
Intel
Model
E7500
Category
Computer Hardware
Language
English
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