R
Intel
®
E7500/E7505 Chipset MCH Thermal Design Guide 3
Contents
1 Introduction ..........................................................................................................................7
1.1 Design Flow ............................................................................................................8
1.2 Definition of Terms..................................................................................................9
1.3 Reference Documents ..........................................................................................10
2 Packaging Technology ......................................................................................................11
3 Thermal Simulation............................................................................................................13
4 Thermal Specifications ......................................................................................................15
4.1 Case Temperature and Thermal Design Power ...................................................15
4.2 Die Temperature...................................................................................................15
5 Thermal Metrology.............................................................................................................17
5.1 Die Temperature Measurements ..........................................................................17
5.1.1 0° Angle Attach Methodology ................................................................17
5.2 Power Simulation Software...................................................................................19
6 Reference Thermal Solutions ............................................................................................21
6.1 Operating Environment .........................................................................................21
6.2 Mechanical Design Envelope................................................................................21
6.3 Thermal Solution Assembly ..................................................................................23
6.3.1 Heatsink Orientations ............................................................................25
6.3.2 Extruded Heatsink Profiles ....................................................................26
6.3.3 Mechanical Interface Material ...............................................................27
6.3.4 Thermal Interface Material ....................................................................27
6.3.5 Heatsink Clip .........................................................................................27
6.3.6 Clip Retention Anchors..........................................................................28
6.3.7 Board Level Component Keep-out Dimensions ....................................28
6.4 Reliability Guidelines.............................................................................................30
Appendix A: Thermal Solution Component Suppliers ...............................................................................31
Appendix B: Mechanical Drawings............................................................................................................33
To Next Page
Loading...
Need help?
General
