Lenovo ThinkCentre M900z User Manual

AppendixA.Regulatoryinformation
Thelatestcomplianceinformationisavailableathttp://www.lenovo.com/compliance.
Exportclassificationnotice
ThisproductissubjecttotheUnitedStatesExportAdministrationRegulations(EAR)andhasanExport
ClassificationControlNumber(ECCN)of5A992.c.Itcanbere-exportedexcepttoanyoftheembargoed
countriesintheEARE1countrylist.
Electronicemissionsnotices
ThefollowinginformationreferstoLenovopersonalcomputermachinetypes10F2,10F3,10F4,and10F5.
FederalCommunicationsCommissionDeclarationofConformity
ThisequipmenthasbeentestedandfoundtocomplywiththelimitsforaClassBdigitaldevice,pursuant
toPart15oftheFCCRules.Theselimitsaredesignedtoprovidereasonableprotectionagainstharmful
interferenceinaresidentialinstallation.Thisequipmentgenerates,uses,andcanradiateradiofrequency
energyand,ifnotinstalledandusedinaccordancewiththeinstructions,maycauseharmfulinterference
toradiocommunications.However,thereisnoguaranteethatinterferencewillnotoccurinaparticular
installation.Ifthisequipmentdoescauseharmfulinterferencetoradioortelevisionreception,whichcanbe
determinedbyturningtheequipmentoffandon,theuserisencouragedtotrytocorrecttheinterferenceby
oneormoreofthefollowingmeasures:
•Reorientorrelocatethereceivingantenna.
•Increasetheseparationbetweentheequipmentandreceiver.
•Connecttheequipmentintoanoutletonacircuitdifferentfromthattowhichthereceiverisconnected.
•Consultanauthorizeddealerorservicerepresentativeforhelp.
Lenovoisnotresponsibleforanyradioortelevisioninterferencecausedbyusingotherthanspecifiedor
recommendedcablesandconnectorsorbyunauthorizedchangesormodificationstothisequipment.
Unauthorizedchangesormodificationscouldvoidtheuser'sauthoritytooperatetheequipment.
ThisdevicecomplieswithPart15oftheFCCRules.Operationissubjecttothefollowingtwoconditions:(1)
thisdevicemaynotcauseharmfulinterference,and(2)thisdevicemustacceptanyinterferencereceived,
includinginterferencethatmaycauseundesiredoperation.
ResponsibleParty:
Lenovo(UnitedStates)Incorporated
1009ThinkPlace-BuildingOne
Morrisville,NC27560
PhoneNumber:919-294-5900
IndustryCanadaClassBemissioncompliancestatement
CANICES-3(B)/NMB-3(B)
EuropeanUnion-CompliancetoDirectivesforITE(InformationT echnologyEquipment)andRadio
Equipment
©CopyrightLenovo2015,2016
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Lenovo ThinkCentre M900z Specifications

General

Panel type	TFT
Screen shape	Flat
LED backlight	Yes
Display diagonal	23.8 \
Native aspect ratio	16:9
Intel segment tagging	Enterprise, Professional
Memory slots	2
Internal memory	8 GB
Memory slots type	SO-DIMM
Memory clock speed	2133 MHz
Memory form factor	DIMM/SO-DIMM
Internal memory type	DDR4-SDRAM
Maximum internal memory	32 GB
Memory layout (slots x size)	1 x 8 GB
HDD speed	7200 RPM
Storage media	HDD
Optical drive type	DVD±RW
Total storage capacity	500 GB
Number of storage drives installed	1
On-board graphics card ID	1912
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 530
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	1.74 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1050 MHz
Number of displays supported (on-board graphics)	3
Product color	Black
Product type	All-in-One PC
RMS rated power	6 W
Wi-Fi standards	802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
AC adapter power	150 W
USB 2.0 ports quantity	0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	6
Recovery operating system	Windows 10 Pro
Operating system installed	Windows 7 Professional
Operating system architecture	64-bit
Tcase	71 °C
Bus type	DMI3
Stepping	R0
Processor code	SR2BX
Processor cache	6 MB
Processor model	i5-6500
System bus rate	8 GT/s
Processor family	Intel® Core™ i5
Processor series	Intel Core i5-6500 Desktop series
Processor socket	LGA 1151 (Socket H4)
Processor threads	4
Processor codename	Skylake
Processor frequency	3.2 GHz
Processor cache type	Smart Cache
Processor lithography	14 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	3.0
Processor boost frequency	3.6 GHz
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	65 W
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3L-SDRAM, DDR4-SDRAM
Memory voltage supported by processor	1.35 V
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	2133, 1333, 1600, 1866 MHz
Memory bandwidth supported by processor (max)	34.1 GB/s
Maximum internal memory supported by processor	64 GB
Scalability	1S
Processor ARK ID	88184
Processor package size	37.5 x 37.5 mm
Supported instruction sets	SSE4.2, AVX 2.0, SSE4.1
Thermal solution specification	PCG 2015C
Intel Stable Image Platform Program (SIPP) version	1.00

Weight and Dimensions

Depth (with stand)	253 mm
Height (with stand)	505 mm
Weight (with stand)	9400 g
Depth (without stand)	45 mm
Width (without stand)	584 mm
Height (without stand)	390 mm
Weight (without stand)	6800 g