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Sony HCD-FX900W User Manual

Sony HCD-FX900W
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11
HCD-FX900W
•POWER board service position
POWER board
POWER board
insulating
sheet

Table of Contents

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Sony HCD-FX900W Specifications

General IconGeneral
BrandSony
ModelHCD-FX900W
CategoryReceiver
LanguageEnglish

Summary

SPECIFICATIONS

AUDIO POWER SPECIFICATIONS

Details output power and total harmonic distortion for various speaker configurations.

Video section

Lists video output and input specifications including HDMI and component.

General

Power requirements

Specifies the voltage and frequency for operation.

Dimensions (approx.)

Provides approximate physical dimensions of the unit.

SAFETY CHECK-OUT

LEAKAGE TEST

Describes AC leakage testing procedure and limits.

NOTES ON LASER DIODE EMISSION CHECK

DISC SLOT LOCK

Explains how to lock and unlock the disc tray for anti-theft demonstrations.

Discharge the charged electricity in capacitors to prevent electric shock as follows

Use a resistor of 800 ohms, 2 Watts for discharging the following capacitors.

Safety instruction for discharging capacitors using a specific resistor.

Fix the capacitors with adhesive agent as follows

PRECAUTION WHEN INSTALLING A NEW OP UNIT / PRECAUTION BEFORE UNSOLDERING THE STATIC ELECTRICITY PREVENTION SOLDER BRIDGE

Precautions for installing new optical pick-up units and handling solder bridges.

Precaution when replacing the BUTTON

MAIN board service position (side A)

MAIN board service position (side A)

Visual guide showing the service position of the MAIN board (Side A).

MAIN board service position (side B)

MAIN board service position (side B)

Visual guide showing the service position of the MAIN board (Side B).

DMB12 board service position

DMB12 board service position

Visual guide illustrating the service position of the DMB12 board.

POWER board service position

POWER board service position

Visual guide showing the service position of the POWER board.

SECTION 2 GENERAL

Front panel

Identifies controls and connectors on the front panel of the unit.

Rear panel

Identifies ports and connectors on the rear panel of the unit.

Front panel display

About the indications in the front panel display

Explains the meaning of various indicators on the front panel display.

Remote control

BUTTON DESCRIPTIONS

Lists the functions of various buttons on the remote control.

SECTION 3 DISASSEMBLY

3-1. DISASSEMBLY FLOW

Outlines the step-by-step procedure for disassembling the unit.

SECTION 4 ASSEMBLY

4-1. HOW TO INSTALL THE CAM (EJECT LOCK)

Instructions for installing the cam (eject lock) mechanism.

4-2. HOW TO INSTALL THE CAM (GEAR)

Procedure for installing the cam (gear) component.

SECTION 5 TEST MODE

1. Cold Reset

Clears all RAM data, resetting the system to initial conditions.

2. Panel Test Mode

Mode for checking software version, FL, LED, and KEY status.

3. Disc Tray Lock

Function to lock the disc tray for anti-theft demonstration.

4. DVD Ship Mode

Mode used for returning the set to the customer after repair.

DVD SECTION

8-1. GENERAL DESCRIPTION

Overview of the IOP measurement function for diagnosis and adjustment.

8-2. HOW TO ENTER TEST MODE

Procedure to enter the Test Mode menu for diagnosis.

8-3. EXECUTING IOP MEASUREMENT

Standard procedures for executing IOP measurement.

8-4. EMERGENCY HISTORY

8-4-1. Clear the Laser Hour

Resets laser hour data for both CD and DVD.

8-4-2. Clear the Emergency History

Resets all emergency history error codes.

SECTION 6 ELECTRICAL ADJUSTMENT

DVD SECTION

Procedures for adjustment and measurement when replacing the base unit.

DIAT SECTION

Adjustment procedure for DIAT signal RF level.

SECTION 7 DIAGRAMS

• Circuit Boards Location

Illustrates the physical location of various circuit boards within the unit.

• Waveforms – DMB12 Board –

1 IC101 6 (DVDRFIP)

Waveform for DVDRFIP signal at IC101.

2 IC101 <xx. (XTALI)

Waveform for XTALI signal at IC101.

7 IC101 <x// (YUV4)

Waveform for YUV4 signal at IC101.

– MAIN Board –

0 IC702 ws (XIN(I))

Waveform for XIN(I) signal at IC702.

qa IC2 <zvx (CLKIN)

Waveform for CLKIN signal at IC2.

qs IC501 qg (Xin)

Waveform for Xin signal at IC501.

qd IC3010 rk (XFSOIN)

Waveform for XFSOIN signal at IC3010.

• IC Block Diagrams

– RELAY Board –

IC block diagram for the RELAY board components.

– DMB12 Board –

IC block diagram for DMB12 board components.

– MAIN Board –

IC block diagrams for CXD9883M components on the MAIN board.

– MAIN Board –

IC671 SN74LV126APWR

Logic diagram for IC671, a SN74LV126APWR IC.

IC704 SN74LVC257APWR

Logic diagram for IC704, a SN74LVC257APWR IC.

IC3010, IC3020, IC3030 CXD9876R

Block diagrams for IC3010, IC3020, IC3030, CXD9876R.

SECTION 8 EXPLODED VIEWS

8-1. OVERALL ASSY

Exploded view illustrating the assembly of the main unit components.

8-2. FRONT PANEL ASSY

SECTION 9 ELECTRICAL PARTS LIST

NOTE:

General notes regarding part number differences and availability.

When indicating parts by reference number, please include the board name.

Instruction on how to reference parts in the list.

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