Agilent Technologies 6063B User Manual

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2. If part 1 passes selftest, the test continues and checks the read/write cycles and the internal trigger circuit. If these tests
pass, the secondary interface selftest are performed. If the read/write or internal trigger test fails, the front panel
displays "ERROR x" for two seconds, then normal voltage/current will be displayed and the
Err annunciator will turn
on. Depressing the
(blue shift key) followed by the key will cause ''ERROR -330" to be displayed.
If "ERROR -4" was displayed for 2 seconds, the read/write test failed. If "ERROR -5" was displayed for 2 seconds, the
internal trigger test failed.
Secondary Interface
The turn-on selftest sequence of the secondary microprocessor consists of two parts:
1.
The selftest is performed by the secondary microprocessor (U301) and starts when the secondary power clear
( SPCLR ) signal goes false (High). Any secondary failures are reported to the primary interface. The secondary
microprocessor will first check its internal RAM, ROM, and timer. If one of these tests fail, selftest is halted and the
following will be displayed:
"ERROR -101" - RAM failure
"ERROR -102" - ROM failure
"ERROR -103" - Timer failure
It is possible for a secondary RAM, ROM, or Timer failure to "lock-up" the secondary processor and no secondary error
number is reported. If this occurs try to isolate the problem by performing the Secondary Interface S.A.
2.
If part 1 passes selftest, the test continues by checking the secondary EEPROM which stores the load's GP-IB address
and model number as well as the constants used in calibrating the load. Next the operation and accuracy of the main
and transient DACs are tested. If these tests pass, the volts/amps readings will appear on the display indicating that the
selftest has been successfully completed (see Chapter 3 in the Operating Manual).
If the EEPROM or any of the DAC tests fail, the front panel displays ''ERROR -xxx" for 2 seconds, then "INP DOWN
1" followed by "INPUT DWN". Finally the
Err annunciator will turn on. Depressing the (blue shift key)
followed by the
key, will cause "ERROR -330" to be displayed. Depressing these keys a second time, will
cause "ERROR -240" to be displayed. The error code number that appeared for 2 seconds could be one of the
following:
"ERROR -104" - EEPROM checksum failure
"ERROR -105" - Main DAC tolerance is high
"ERROR -106" - Main DAC tolerance is low
"ERROR -107" - Transient DAC tolerance is high
"ERROR -108" - Transient DAC tolerance is low
If error "UNKNOWN" is displayed the EEPROM (U211) must be initialized.

Agilent Technologies 6063B Specifications

General

Brand	Agilent Technologies
Model	6063B
Category	Accessories
Language	English

Summary

CERTIFICATION

WARRANTY

Describes the product warranty terms and conditions, including repair/replacement options.

LIMITATION OF WARRANTY

Details limitations and disclaimers of warranty coverage for the product.

EXCLUSIVE REMEDIES

States the sole and exclusive remedies available to the customer for product defects.

ASSISTANCE

Provides information on obtaining further support and Agilent Technologies programs.

SAFETY SUMMARY

BEFORE APPLYING POWER

Precautions and checks to perform before powering the instrument.

GROUND THE INSTRUMENT

Instructions for proper grounding of the instrument for electrical safety.

FUSES

Guidance on using correct fuses and avoiding hazards.

DO NOT OPERATE IN AN EXPLOSIVE ATMOSPHERE

Safety warning against operating the instrument in hazardous environments.

KEEP AWAY FROM LIVE CIRCUITS

Safety warning regarding access to live electrical circuits.

DO NOT SERVICE OR ADJUST ALONE

Safety warning advising against servicing or adjusting the unit without assistance.

DO NOT EXCEED INPUT RATINGS

Warning to operate the instrument within specified input voltage and frequency limits.

SAFETY SYMBOLS

Explanation of safety symbols used in the manual and on the instrument.

DO NOT SUBSTITUTE PARTS OR MODIFY INSTRUMENT

Warning against using non-specified parts or performing unauthorized modifications.

Introduction

Scope

Defines the manual's purpose, content, and target audience.

Related Documents

Lists other relevant manuals and guides for the electronic load.

Firmware Revisions

Explains how to identify and understand firmware version differences.

Manual Revisions

Describes how the service manual is updated and revision tracking.

Safety Considerations

Electrostatic Discharge

Precautions to prevent damage to sensitive components from ESD.

Verification

Introduction

Overview of the chapter's verification procedures for the electronic loads.

Test Equipment Required

Lists necessary test equipment for performing verification tests.

CC Mode Test

CV Mode Test

CR Mode Test

Transient Operation and Slew Circuit Test

CC Mode PARD Test

CC Mode Power Limit

PERFORMANCE TEST RECORD - Agilent 6060B ELECTRONIC LOAD (Page 1 of 2)

Test Equipment Used

Lists the specific test equipment models used for performance verification.

PERFORMANCE TEST RECORD - Agilent 6063B ELECTRONIC LOAD (Page 1 of 2)

Test Equipment Used

Lists the specific test equipment models used for performance verification.

Troubleshooting

Introduction

Introduces troubleshooting procedures and general guidelines for the electronic loads.

Test Equipment Required

Lists the test equipment necessary for effective troubleshooting.

Overall Troubleshooting Procedures

Describes the general flowchart and approach for troubleshooting.

Selftest Sequence and Error Messages

Explains self-test results and lists potential error codes.

Primary Interface

Details the self-test procedures for the primary interface circuits.

Secondary Interface

Details the self-test procedures for the secondary interface circuits.

Test Points

Describes key test points used in troubleshooting procedures.

Signature Analysis

Explains the signature analysis technique for troubleshooting digital circuits.

Firmware Revisions

Links firmware revisions to specific signature analysis tables.

Test Header Jumper Positions

Describes jumper settings on test headers for various testing modes.

Test Setup for Signature Analysis

Details the setup required for performing signature analysis tests.

DAC Circuits Troubleshooting (Figure 3-3)

Details troubleshooting steps for the DAC circuits.

Slew Circuit Troubleshooting (Figure 3-4)

Guides troubleshooting for the slew circuits.

CC/CV CONTROL CIRCUIT TROUBLESHOOTING (Figure 3-5)

Troubleshooting steps for the CC/CV control circuits.

Input Power Stages Troubleshooting (Figure 3-6)

Troubleshooting the input power stages of the electronic load.

Transient Generator Troubleshooting (Figure 3-7)

Troubleshooting the transient generator circuit.

General Troubleshooting

General troubleshooting steps for the transient generator.

Transient Generator Frequency

Troubleshooting issues with changing the transient generator frequency.

Toggle or Pulse Modes

Troubleshooting the transient generator's toggle and pulse modes.

Trigger Circuit Troubleshooting (Figure 3-8)

Troubleshooting the trigger circuit, including signal lines.

Overcurrent Circuit Troubleshooting (Figure 3-9)

Troubleshooting the overcurrent protection circuit.

Overpower Circuit Troubleshooting (Figure 3-10)

Troubleshooting the overpower protection circuit.

Post Repair Calibration

EEPROM Initialization

Steps to initialize the EEPROM after component replacement.

Disassembly Procedures

AC Receptacle

Procedure for removing the AC receptacle from the unit.

Fan

Procedure for removing the fan assembly from the unit.

Front Panel

Procedure for removing the front panel assembly.

Keypad

Procedure for removing the keypad assembly.

LCD Display and Window

Procedure for removing the LCD display and its window.

Line Switch

Procedure for removing the line switch.

Heat Sinks

Procedure for removing heat sinks.

PC Board

Procedure for removing the main PC board.

FETs Q1 and Q2

Procedure for replacing FET subassemblies.

Principles Of Operation

Introduction

Overview of the chapter's explanation of the unit's operation principles.

Bias Supplies

Description of the primary and secondary bias supplies.

Primary Interface

Description of the circuitry providing user interface functions.

Front Panel

Description of the front panel components and their functions.

Isolators

Explanation of optical isolators used for data transfer.

Secondary Interface

Description of the secondary interface circuit's function.

DACs and Slew Rate Control

Explanation of DACs and slew rate control circuits.

CC/CV Control

Description of CC and CV control loop operations.

Protection Circuits

Description of overvoltage, overpower, overcurrent, and overtemperature protection.

Turn-On/Clear Circuit

Explanation of the turn-on and clear circuit function.

Input Power Stages

Description of the input power stages and their control.

Replaceable Parts

Introduction

Overview of information related to replaceable parts.

How To Order Parts

Instructions and information required for ordering replacement parts.

Diagrams

Introduction

Overview of the chapter's diagrams and their purpose.

Schematic Diagram

Explanation of the organization and content of schematic diagrams.

Inter-Sheet Connections

How signals are routed between different schematic sheets.

Intra-Sheet Connections

How signals are routed within a single schematic sheet.

Test Point Locations

Describes the location of test points on the main circuit board.

Component Location Diagram

Describes the diagram used for locating electrical components.

Manual Backdating

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