Agilent Technologies 6063B User Manual

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Isolators
Data is transferred serially between the primary interface and the secondary interface via optical isolators. As described
above, the primary interface circuits are referenced to chassis ground while the secondary interface and input power circuits
are reference to load common. Neither of the load's input terminals ( + or - ) can exceed
± 240Vdc from ground.
The trigger signal is also transferred from the primary interface via an optical isolator. The trigger signal can be used to
control data transfers into the DAC circuits and can also be used in transient operation.
Secondary Interface
The secondary interface circuit translates the serial data received from the primary interface into a parallel data bus and
other control signals. The data bus and control signals are sent to the power control circuits to control the input power stages
in accordance with the programmed parameters. Status and measurement information is also read back to the GP-IB
controller and/or the front panel display via the secondary and primary interfaces.
DACs and Slew Rate Control
Programmable main and transient DAC circuits convert the programmed data into an analog signal (PROG) that controls the
conduction of the input power stages. Depending upon the mode of operation, the main DAC circuit converts the
programmed value of current, resistance, or voltage into an analog signal to control the input power stages. The conversion
can be initiated by a GP-IB command or by a trigger (GP-IB or external).
The transient DAC circuit and a programmable generator allow transient operation in the selected mode. Transient
operation causes the input power stages to switch between two load levels. Transient operation can be programmed at a
continuous rate or can be triggered (programmed trigger or an external trigger signal) to produce a transient pulse or to
switch between two load levels. Programmable slew rate control circuits allow a controlled transition from one load setting
to another.
An external programming signal can also be used to control conduction of the input power stages in the CC or CV mode. A
0 to 10V external programming signal corresponds to the 0 to full scale input rang in the CC or CV mode. The external
signal is combined with the programmed values from the main and transient DAC circuits.
A readback DAC circuit returns the input current, input voltage, and heatsink temperature values to the secondary
microprocessor. The DAC circuit along with a comparator circuit are controlled by the secondary microprocessor to
successively approximate the value of the monitored signal to 12-bit resolution. The readback DAC and comparator circuit
also return a test signal to the microprocessor during self test to determine if the DAC circuits are operating properly.
CC/CV Control
Depending upon which operating mode (and range in the CR mode) is selected, either the CC or the CV loop controls the
conduction of the input power stages. If the CC or CR (middle or high resistance ranges only) mode is selected, the CC loop
controls the conduction of the input power stages according to the selected mode and the programmed value of current or
resistance. A range control signal is sent to the CC control circuit to provide the proper scaling for the low and high current
ranges or the middle and high resistance ranges.
If the CV or CR (low resistance range) mode is selected, the CV loop controls the conduction of the input power stages
according to the selected mode and the programmed value of voltage or resistance.

Agilent Technologies 6063B Specifications

General

Brand	Agilent Technologies
Model	6063B
Category	Accessories
Language	English

Summary

CERTIFICATION

WARRANTY

Describes the product warranty terms and conditions, including repair/replacement options.

LIMITATION OF WARRANTY

Details limitations and disclaimers of warranty coverage for the product.

EXCLUSIVE REMEDIES

States the sole and exclusive remedies available to the customer for product defects.

ASSISTANCE

Provides information on obtaining further support and Agilent Technologies programs.

SAFETY SUMMARY

BEFORE APPLYING POWER

Precautions and checks to perform before powering the instrument.

GROUND THE INSTRUMENT

Instructions for proper grounding of the instrument for electrical safety.

FUSES

Guidance on using correct fuses and avoiding hazards.

DO NOT OPERATE IN AN EXPLOSIVE ATMOSPHERE

Safety warning against operating the instrument in hazardous environments.

KEEP AWAY FROM LIVE CIRCUITS

Safety warning regarding access to live electrical circuits.

DO NOT SERVICE OR ADJUST ALONE

Safety warning advising against servicing or adjusting the unit without assistance.

DO NOT EXCEED INPUT RATINGS

Warning to operate the instrument within specified input voltage and frequency limits.

SAFETY SYMBOLS

Explanation of safety symbols used in the manual and on the instrument.

DO NOT SUBSTITUTE PARTS OR MODIFY INSTRUMENT

Warning against using non-specified parts or performing unauthorized modifications.

Introduction

Scope

Defines the manual's purpose, content, and target audience.

Related Documents

Lists other relevant manuals and guides for the electronic load.

Firmware Revisions

Explains how to identify and understand firmware version differences.

Manual Revisions

Describes how the service manual is updated and revision tracking.

Safety Considerations

Electrostatic Discharge

Precautions to prevent damage to sensitive components from ESD.

Verification

Introduction

Overview of the chapter's verification procedures for the electronic loads.

Test Equipment Required

Lists necessary test equipment for performing verification tests.

CC Mode Test

CV Mode Test

CR Mode Test

Transient Operation and Slew Circuit Test

CC Mode PARD Test

CC Mode Power Limit

PERFORMANCE TEST RECORD - Agilent 6060B ELECTRONIC LOAD (Page 1 of 2)

Test Equipment Used

Lists the specific test equipment models used for performance verification.

PERFORMANCE TEST RECORD - Agilent 6063B ELECTRONIC LOAD (Page 1 of 2)

Test Equipment Used

Lists the specific test equipment models used for performance verification.

Troubleshooting

Introduction

Introduces troubleshooting procedures and general guidelines for the electronic loads.

Test Equipment Required

Lists the test equipment necessary for effective troubleshooting.

Overall Troubleshooting Procedures

Describes the general flowchart and approach for troubleshooting.

Selftest Sequence and Error Messages

Explains self-test results and lists potential error codes.

Primary Interface

Details the self-test procedures for the primary interface circuits.

Secondary Interface

Details the self-test procedures for the secondary interface circuits.

Test Points

Describes key test points used in troubleshooting procedures.

Signature Analysis

Explains the signature analysis technique for troubleshooting digital circuits.

Firmware Revisions

Links firmware revisions to specific signature analysis tables.

Test Header Jumper Positions

Describes jumper settings on test headers for various testing modes.

Test Setup for Signature Analysis

Details the setup required for performing signature analysis tests.

DAC Circuits Troubleshooting (Figure 3-3)

Details troubleshooting steps for the DAC circuits.

Slew Circuit Troubleshooting (Figure 3-4)

Guides troubleshooting for the slew circuits.

CC/CV CONTROL CIRCUIT TROUBLESHOOTING (Figure 3-5)

Troubleshooting steps for the CC/CV control circuits.

Input Power Stages Troubleshooting (Figure 3-6)

Troubleshooting the input power stages of the electronic load.

Transient Generator Troubleshooting (Figure 3-7)

Troubleshooting the transient generator circuit.

General Troubleshooting

General troubleshooting steps for the transient generator.

Transient Generator Frequency

Troubleshooting issues with changing the transient generator frequency.

Toggle or Pulse Modes

Troubleshooting the transient generator's toggle and pulse modes.

Trigger Circuit Troubleshooting (Figure 3-8)

Troubleshooting the trigger circuit, including signal lines.

Overcurrent Circuit Troubleshooting (Figure 3-9)

Troubleshooting the overcurrent protection circuit.

Overpower Circuit Troubleshooting (Figure 3-10)

Troubleshooting the overpower protection circuit.

Post Repair Calibration

EEPROM Initialization

Steps to initialize the EEPROM after component replacement.

Disassembly Procedures

AC Receptacle

Procedure for removing the AC receptacle from the unit.

Fan

Procedure for removing the fan assembly from the unit.

Front Panel

Procedure for removing the front panel assembly.

Keypad

Procedure for removing the keypad assembly.

LCD Display and Window

Procedure for removing the LCD display and its window.

Line Switch

Procedure for removing the line switch.

Heat Sinks

Procedure for removing heat sinks.

PC Board

Procedure for removing the main PC board.

FETs Q1 and Q2

Procedure for replacing FET subassemblies.

Principles Of Operation

Introduction

Overview of the chapter's explanation of the unit's operation principles.

Bias Supplies

Description of the primary and secondary bias supplies.

Primary Interface

Description of the circuitry providing user interface functions.

Front Panel

Description of the front panel components and their functions.

Isolators

Explanation of optical isolators used for data transfer.

Secondary Interface

Description of the secondary interface circuit's function.

DACs and Slew Rate Control

Explanation of DACs and slew rate control circuits.

CC/CV Control

Description of CC and CV control loop operations.

Protection Circuits

Description of overvoltage, overpower, overcurrent, and overtemperature protection.

Turn-On/Clear Circuit

Explanation of the turn-on and clear circuit function.

Input Power Stages

Description of the input power stages and their control.

Replaceable Parts

Introduction

Overview of information related to replaceable parts.

How To Order Parts

Instructions and information required for ordering replacement parts.

Diagrams

Introduction

Overview of the chapter's diagrams and their purpose.

Schematic Diagram

Explanation of the organization and content of schematic diagrams.

Inter-Sheet Connections

How signals are routed between different schematic sheets.

Intra-Sheet Connections

How signals are routed within a single schematic sheet.

Test Point Locations

Describes the location of test points on the main circuit board.

Component Location Diagram

Describes the diagram used for locating electrical components.

Manual Backdating

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