Working on your computer
Safety precautions
The safety precautions chapter details the primary steps to be taken before performing any disassembly instructions.
Observe the following safety precautions before you perform any installation or break/fix procedures involving disassembly or
reassembly:
● Turn off the system and all attached peripherals.
● Disconnect the system and all attached peripherals from AC power.
● Disconnect all network cables, telephone, and telecommunications lines from the system.
● Use an ESD field service kit when working inside any notebook to avoid electrostatic discharge (ESD) damage.
● After removing any system component, carefully place the removed component on an anti-static mat.
● Wear shoes with non-conductive rubber soles to reduce the chance of getting electrocuted.
Standby power
Dell products with standby power must be unplugged before you open the case. Systems that incorporate standby power are
essentially powered while turned off. The internal power enables the system to be remotely turned on (wake on LAN) and
suspended into a sleep mode and has other advanced power management features.
Unplugging, pressing and holding the power button for 15 seconds should discharge residual power in the system board.
notebooks.
Bonding
Bonding is a method for connecting two or more grounding conductors to the same electrical potential. This is done through
the use of a field service electrostatic discharge (ESD) kit. When connecting a bonding wire, ensure that it is connected to bare
metal and never to a painted or non-metal surface. The wrist strap should be secure and in full contact with your skin, and
ensure that you remove all jewelry such as watches, bracelets, or rings prior to bonding yourself and the equipment.
Electrostatic discharge—ESD protection
ESD is a major concern when you handle electronic components, especially sensitive components such as expansion cards,
processors, memory DIMMs, and system boards. Very slight charges can damage circuits in ways that may not be obvious, such
as intermittent problems or a shortened product life span. As the industry pushes for lower power requirements and increased
density, ESD protection is an increasing concern.
Due to the increased density of semiconductors used in recent Dell products, the sensitivity to static damage is now higher than
in previous Dell products. For this reason, some previously approved methods of handling parts are no longer applicable.
Two recognized types of ESD damage are catastrophic and intermittent failures.
● Catastrophic – Catastrophic failures represent approximately 20 percent of ESD-related failures. The damage causes
an immediate and complete loss of device functionality. An example of catastrophic failure is a memory DIMM that has
received a static shock and immediately generates a "No POST/No Video" symptom with a beep code emitted for missing or
nonfunctional memory.
● Intermittent – Intermittent failures represent approximately 80 percent of ESD-related failures. The high rate of
intermittent failures means that most of the time when damage occurs, it is not immediately recognizable. The DIMM
receives a static shock, but the tracing is merely weakened and does not immediately produce outward symptoms related to
the damage. The weakened trace may take weeks or months to melt, and in the meantime may cause degradation of memory
integrity, intermittent memory errors, etc.
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