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Dell Latitude 7320 User Manual

Dell Latitude 7320
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4. Disconnect all attached network devices and peripherals, such as keyboard, mouse, and monitor from your computer.
CAUTION: To disconnect a network cable, first unplug the cable from your computer and then unplug the
cable from the network device.
5. Remove any media card and optical disc from your computer, if applicable.
Safety precautions
The safety precautions chapter details the primary steps to be taken before performing any disassembly instructions.
Observe the following safety precautions before you perform any installation or break/fix procedures involving disassembly or
reassembly:
Turn off the system and all attached peripherals.
Disconnect the system and all attached peripherals from AC power.
Disconnect all network cables, telephone, and telecommunications lines from the system.
Use an ESD field service kit when working inside any notebook to avoid electrostatic discharge (ESD) damage.
After removing any system component, carefully place the removed component on an anti-static mat.
Wear shoes with non-conductive rubber soles to reduce the chance of getting electrocuted.
Standby power
Dell products with standby power must be unplugged before you open the case. Systems that incorporate standby power are
essentially powered while turned off. The internal power enables the system to be remotely turned on (wake on LAN) and
suspended into a sleep mode and has other advanced power management features.
Unplugging, pressing and holding the power button for 20 seconds should discharge residual power in the system board.
Remove the battery from notebooks.
Bonding
Bonding is a method for connecting two or more grounding conductors to the same electrical potential. This is done through
the use of a field service electrostatic discharge (ESD) kit. When connecting a bonding wire, ensure that it is connected to bare
metal and never to a painted or non-metal surface. The wrist strap should be secure and in full contact with your skin, and
ensure that you remove all jewelry such as watches, bracelets, or rings prior to bonding yourself and the equipment.
Electrostatic dischargeESD protection
ESD is a major concern when you handle electronic components, especially sensitive components such as expansion cards,
processors, memory DIMMs, and system boards. Very slight charges can damage circuits in ways that may not be obvious, such
as intermittent problems or a shortened product life span. As the industry pushes for lower power requirements and increased
density, ESD protection is an increasing concern.
Due to the increased density of semiconductors used in recent Dell products, the sensitivity to static damage is now higher than
in previous Dell products. For this reason, some previously approved methods of handling parts are no longer applicable.
Two recognized types of ESD damage are catastrophic and intermittent failures.
Catastrophic Catastrophic failures represent approximately 20 percent of ESD-related failures. The damage causes
an immediate and complete loss of device functionality. An example of catastrophic failure is a memory DIMM that has
received a static shock and immediately generates a "No POST/No Video" symptom with a beep code emitted for missing or
nonfunctional memory.
Intermittent Intermittent failures represent approximately 80 percent of ESD-related failures. The high rate of
intermittent failures means that most of the time when damage occurs, it is not immediately recognizable. The DIMM
receives a static shock, but the tracing is merely weakened and does not immediately produce outward symptoms related to
the damage. The weakened trace may take weeks or months to melt, and in the meantime may cause degradation of memory
integrity, intermittent memory errors, etc.
The more difficult type of damage to recognize and troubleshoot is the intermittent (also called latent or "walking wounded")
failure.
Perform the following steps to prevent ESD damage:
Working on your computer
9

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Dell Latitude 7320 Specifications

General IconGeneral
Processor cores2
Processor modeli3-1110G4
Processor familyIntel® Core™ i3
Processor frequency- GHz
Processor manufacturerIntel
Processor boost frequency3.9 GHz
Configurable TDP-down frequency1.5 GHz
Memory clock speed4267 MHz
Internal memory typeLPDDR4x-SDRAM
Maximum internal memory4 GB
Panel typeWVA
Pixel density177 ppi
Display diagonal13 \
Display brightness500 cd/m²
Display resolution1920 x 1280 pixels
Native aspect ratio3:2
Anti-reflective coatingYes
Speaker power2.5 W
AC adapter power65 W
AC adapter frequency50 - 60 Hz
AC adapter input voltage100 - 240 V
Operating altitude-15.2 - 3048 m
Non-operating altitude-15.2 - 10668 m
Storage temperature (T-T)-40 - 65 °C
Operating temperature (T-T)0 - 35 °C
Storage relative humidity (H-H)0 - 95 %
Operating relative humidity (H-H)10 - 90 %
Wi-Fi standardsWi-Fi 6 (802.11ax)
Bluetooth version5.1
Wi-Fi data rate (max)2400 Mbit/s
Mobile network connectionNo
SSD interfaceM.2, PCI Express
Storage mediaSSD
Internal storage capacity128 GB
PlatformWindows
Operating system architecture64-bit
Rear camera typeSingle camera
Video capturing speed30 fps
Rear camera resolution1920 x 1080 pixels
Rear camera resolution (numeric)8 MP
Cables includedAC
Battery voltage8.9 V
Battery capacity4494 mAh
Battery life (max)- h
Battery recharge time4 h
Device typeTablet PC
Form factorSlate
Product colorGray
Housing materialAluminum
Graphics cardIris Xe Graphics
Weight and Dimensions IconWeight and Dimensions
Depth207.9 mm
Width288.42 mm
Height8.44 mm
Weight789 g

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