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Ebyte E32 Series User Manual

Ebyte E32 Series
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SX1278 Wireless Module E32 Series User Manual
Copyright ©2012–2017, Chengdu Ebyte Electronic Technology Co., Ltd. 23 / 24
8. Production guidance
8.1 Reflow soldering temperature
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63/Pb37
Sn96.5/Ag3/Cu0.5
Preheat Temperature min Tsmin
100
150
Preheat temperature max (Tsmax)
150
200
Preheat Time (Tsmin to Tsmax)(ts)
60-120 sec
60-120 sec
Average ramp-up rate(Tsmax to Tp)
3/second max
3/second max
Liquidous Temperature (TL)
183
217
TimetLMaintained AboveTL
60-90 sec
30-90 sec
Peak temperatureTp
220-235
230-250
Average ramp-down rateTp to Tsmax
6/second max
6/second max
Time 25 to peak temperature
6 minutes max
8 minutes max
8.2 Reflow soldering curve

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Ebyte E32 Series Specifications

General IconGeneral
BrandEbyte
ModelE32 Series
CategoryWireless modules
LanguageEnglish

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