SX1278 Wireless Module E32 Series User Manual
Copyright ©2012–2017, Chengdu Ebyte Electronic Technology Co., Ltd. 23 / 24
8.1 Reflow soldering temperature
Preheat Temperature min (Tsmin)
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time(tL)Maintained Above(TL)
Average ramp-down rate(Tp to Tsmax)
Time 25℃ to peak temperature
8.2 Reflow soldering curve