Fujitsu Lifebook S760 User Manual

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Chapter 5
Care and Maintenance
Caring for your LifeBook Notebook
If you use your Fujitsu LifeBook notebook carefully, you will increase its life and reliability. This section
provides some tips for looking after the notebook and its devices.
• THE SYSTEM CONTAINS COMPONENTS THAT CAN BE SEVERELY DAMAGED BY ELECTROSTATIC DISCHARGE (ESD).
TO MINIMIZE RISK TO THE COMPONENTS, OBSERVE THE FOLLOWING PRECAUTIONS:
• BEFORE DOCKING OR UNDOCKING YOUR LIFEBOOK NOTEBOOK (WHEN USING A PORT REPLICATOR), IT IS A
GOOD PRACTICE TO ALWAYS TOUCH A GROUNDED METAL OBJECT TO DISCHARGE STATIC ELECTRICITY BUILT
UP IN YOUR BODY.
• BE SURE TO POWER DOWN YOUR SYSTEM BEFORE ADDING OR REMOVING SYSTEM COMPONENTS. EVEN IF
THE SYSTEM IS IN HIBERNATE OR STANDBY STATES, DATA COULD BE LOST OR MEMORY COULD BE DAMAGED
IF POWER IS STILL AVAILABLE TO THE SYSTEM.
• WHEN INSTALLING OR REMOVING A MEMORY MODULE, HOLD IT BY THE EDGE SO AS NOT TO TOUCH ANY
CONTACTS OR CHIPS. BE CAREFUL NOT TO TOUCH ANY INTERNAL TERMINALS OR COMPONENTS; THE OIL
FROM YOUR FINGERS COULD CAUSE A SHORT TO THE COMPONENTS.
• ELECTRICAL EQUIPMENT MAY BE HAZARDOUS IF MISUSED. OPERATIONS OF THIS PRODUCT OR SIMILAR
PRODUCTS, MUST ALWAYS BE SUPERVISED BY AN ADULT. DO NOT ALLOW CHILDREN ACCESS TO THE INTERIOR OF
ANY ELECTRICAL PRODUCTS AND DO NOT PERMIT THEM TO HANDLE ANY CABLES.

Fujitsu Lifebook S760 Specifications

General

Bus type	DMI
Stepping	C2
Tjunction	105 °C
Processor cache	3 MB
Processor cores	2
Processor model	i3-330M
System bus rate	2.5 GT/s
Processor family	Intel® Core™ i3
Processor series	Intel Core i3-300 Mobile Series
Processor socket	BGA 1288
Processor threads	4
Processor codename	Arrandale
Processing Die size	81 mm²
Processor frequency	2.13 GHz
Processor cache type	Smart Cache
Processor lithography	32 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16
Thermal Design Power (TDP)	35 W
Maximum number of PCI Express lanes	16
Number of Processing Die Transistors	382 M
Motherboard chipset	Intel® QM57 Express
HDD speed	5400 RPM
HDD interface	SATA
Optical drive type	DVD Super Multi
Card reader integrated	Yes
Total storage capacity	320 GB
Display surface	Matt
Display diagonal	13.3 \
Display resolution	1366 x 768 pixels
Native aspect ratio	16:9
Internal memory	2 GB
Memory clock speed	1066 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	8 GB
Memory layout (slots x size)	1 x 2 GB
Audio system	HD Audio
Front camera resolution (numeric)	1.3 MP
Type	PC
Dimensions (WxDxH)	314 x 222 x 30.5 mm
Wireless technology	802.11 a/b/g/n
Compliance industry standards	WMI, PXE, BootP
Bluetooth version	2.1+EDR
Networking features	Gigabit Ethernet, WLAN
Mobile network generation	3G
Trial software	Symantec Norton Internet Security
Bundled software	Adobe Acrobat Reader Application Panel Display Manager ShockSensor Utility Power Saving Utility Wireless Selector Utility EasyGuide Nero Essentials S Norton Internet Security
Operating system installed	Windows 7 Professional
Battery capacity	5800 mAh
Battery life (max)	8 h
Number of battery cells	6
Charging port type	DC-in jack
Serial ports quantity	0
USB 2.0 ports quantity	3
Cable lock slot type	Kensington
Password protection type	BIOS
External video modes refresh rate (max)	60 Hz
Maximum resolution	1920 x 1200 pixels
Discrete graphics card model	Intel® HD Graphics
On-board graphics card base frequency	500 MHz
On-board graphics card dynamic frequency (max)	667 MHz
Pointing device	Touchpad
Keyboard key pitch	19 mm
Keyboard keystroke	2.7 mm
Keyboard number of keys	85
Certification	RoHS, WEEE, HCT, HCL entry, WHQL, ENERGY STAR 5.0, ISO 9241-307, EPEAT Silver
Sustainability certificates	ENERGY STAR
Operating temperature (T-T)	5 - 35 °C
Operating relative humidity (H-H)	20 - 85 %
AC adapter power	80 W
AC adapter input voltage	100 - 240 V
AC adapter output current	4.22 A
AC adapter output voltage	19 V
Battery life with optional 2nd battery	12 h
Processor code	SLBNF
Processor ARK ID	47663
Processor package size	rPGA 37.5x 37.5, BGA 34x28 mm
Graphics & IMC lithography	45 nm
Supported instruction sets	SSE4.1, SSE4.2

Weight and Dimensions

Weight	1600 g