Fujitsu Lifebook S760 User Manual

82 - Memory Upgrade Module
Memory Upgrade Module
Your Fujitsu LifeBook notebook comes with a minimum of 1GB of high speed Double Data Rate 3
Synchronous Dynamic RAM (DDR3-1066 SDRAM) factory installed. To increase your notebook’s memory
capacity, you may install an additional memory upgrade module. The memory upgrade must be a dual-in-
line (DIMM) SDRAM module. To ensure 100% compatibility, purchase the SDRAM module only from
the Fujitsu web store at www.shopfujitsu.com.
Installing Memory Upgrade Modules
1 Turn off power to your notebook, remove any power adapter (AC or auto/airline). Remove the battery.
2 Turn the notebook bottom side up, and remove the screw from the memory upgrade module compartment.
3 Remove the cover.
4 Remove the memory upgrade module from the static guarded sleeve.
5 Align the memory upgrade module with the component side up. Align the connector edge of the module with
the connector slot in the compartment. Be sure the alignment keys line up with those in the slot.
• DO NOT REMOVE ANY SCREWS FROM THE MEMORY UPGRADE MODULE COMPARTMENT EXCEPT THE
ONES SPECIFICALLY SHOWN IN THE DIRECTIONS FOR INSTALLING AND REMOVING THE MEMORY
UPGRADE MODULE.
• THE MEMORY UPGRADE MODULE CAN BE SEVERELY DAMAGED BY ELECTROSTATIC DISCHARGE
(ESD). T
O MINIMIZE RISK TO THE MODULE, OBSERVE THE FOLLOWING PRECAUTIONS:
-- B
EFORE HANDLING A MEMORY MODULE, TOUCH A GROUNDED METAL OBJECT TO DISCHARGE STATIC
ELECTRICITY BUILT UP IN YOUR BODY.
-- W
HEN INSTALLING OR REMOVING A MEMORY MODULE, HOLD IT BY THE EDGE SO AS NOT TO TOUCH
ANY CONTACTS OR CHIPS. BE CAREFUL NOT TO TOUCH ANY INTERNAL COMPUTER TERMINALS OR
COMPONENTS; THE OIL FROM YOUR FINGERS COULD CAUSE A SHORT TO THE COMPONENTS.
-- B
E SURE TO POWER DOWN YOUR SYSTEM BEFORE ADDING OR REMOVING MEMORY MODULES. EVEN
IF THE SYSTEM IS IN HIBERNATE OR STANDBY STATES, DATA COULD BE LOST OR THE MEMORY
COULD BE DAMAGED IF POWER IS STILL AVAILABLE TO THE SYSTEM.

Fujitsu Lifebook S760 Specifications

General

Bus type	DMI
Stepping	C2
Tjunction	105 °C
Processor cache	3 MB
Processor cores	2
Processor model	i3-330M
System bus rate	2.5 GT/s
Processor family	Intel® Core™ i3
Processor series	Intel Core i3-300 Mobile Series
Processor socket	BGA 1288
Processor threads	4
Processor codename	Arrandale
Processing Die size	81 mm²
Processor frequency	2.13 GHz
Processor cache type	Smart Cache
Processor lithography	32 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16
Thermal Design Power (TDP)	35 W
Maximum number of PCI Express lanes	16
Number of Processing Die Transistors	382 M
Motherboard chipset	Intel® QM57 Express
HDD speed	5400 RPM
HDD interface	SATA
Optical drive type	DVD Super Multi
Card reader integrated	Yes
Total storage capacity	320 GB
Display surface	Matt
Display diagonal	13.3 \
Display resolution	1366 x 768 pixels
Native aspect ratio	16:9
Internal memory	2 GB
Memory clock speed	1066 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	8 GB
Memory layout (slots x size)	1 x 2 GB
Audio system	HD Audio
Front camera resolution (numeric)	1.3 MP
Type	PC
Dimensions (WxDxH)	314 x 222 x 30.5 mm
Wireless technology	802.11 a/b/g/n
Compliance industry standards	WMI, PXE, BootP
Bluetooth version	2.1+EDR
Networking features	Gigabit Ethernet, WLAN
Mobile network generation	3G
Trial software	Symantec Norton Internet Security
Bundled software	Adobe Acrobat Reader Application Panel Display Manager ShockSensor Utility Power Saving Utility Wireless Selector Utility EasyGuide Nero Essentials S Norton Internet Security
Operating system installed	Windows 7 Professional
Battery capacity	5800 mAh
Battery life (max)	8 h
Number of battery cells	6
Charging port type	DC-in jack
Serial ports quantity	0
USB 2.0 ports quantity	3
Cable lock slot type	Kensington
Password protection type	BIOS
External video modes refresh rate (max)	60 Hz
Maximum resolution	1920 x 1200 pixels
Discrete graphics card model	Intel® HD Graphics
On-board graphics card base frequency	500 MHz
On-board graphics card dynamic frequency (max)	667 MHz
Pointing device	Touchpad
Keyboard key pitch	19 mm
Keyboard keystroke	2.7 mm
Keyboard number of keys	85
Certification	RoHS, WEEE, HCT, HCL entry, WHQL, ENERGY STAR 5.0, ISO 9241-307, EPEAT Silver
Sustainability certificates	ENERGY STAR
Operating temperature (T-T)	5 - 35 °C
Operating relative humidity (H-H)	20 - 85 %
AC adapter power	80 W
AC adapter input voltage	100 - 240 V
AC adapter output current	4.22 A
AC adapter output voltage	19 V
Battery life with optional 2nd battery	12 h
Processor code	SLBNF
Processor ARK ID	47663
Processor package size	rPGA 37.5x 37.5, BGA 34x28 mm
Graphics & IMC lithography	45 nm
Supported instruction sets	SSE4.1, SSE4.2

Weight and Dimensions

Weight	1600 g