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HP 280 G2 User Manual

HP 280 G2
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Preventing electrostatic damage to equipment
Many electronic components are sensitive to ESD. Circuitry design and structure determine the degree of
sensitivity. The following packaging and grounding precautions are necessary to prevent damage to electric
components and accessories.
To avoid hand contact, transport products in static-safe containers such as tubes, bags, or boxes.
Protect all electrostatic parts and assemblies with conductive or approved containers or packaging.
Keep electrostatic sensitive parts in their containers until they arrive at static-free stations.
Place items on a grounded surface before removing them from their container.
Always be properly grounded when touching a sensitive component or assembly.
Avoid contact with pins, leads, or circuitry.
Place reusable electrostatic-sensitive parts from assemblies in protective packaging or conductive
foam.
Personal grounding methods and equipment
Use the following equipment to prevent static electricity damage to equipment:
Wrist straps are exible straps with a maximum of one-megohm ± 10% resistance in the ground cords.
To provide proper ground, a strap must be worn snug against bare skin. The ground cord must be
connected and t snugly into the banana plug connector on the grounding mat or workstation.
Heel straps/Toe straps/Boot straps can be used at standing workstations and are compatible with
most types of shoes or boots. On conductive oors or dissipative oor mats, use them on both feet with
a maximum of one-megohm ± 10% resistance between the operator and ground.
Static Shielding Protection Levels
Method Voltage
Antistatic plastic
Carbon-loaded plastic
Metallized laminate
1,500
7,500
15,000
Grounding the work area
To prevent static damage at the work area, use the following precautions:
Cover the work surface with approved static-dissipative material. Provide a wrist strap connected to the
work surface and properly grounded tools and equipment.
Use static-dissipative mats, foot straps, or air ionizers to give added protection.
Handle electrostatic sensitive components, parts, and assemblies by the case or PCB laminate. Handle
them only at static-free work areas.
Turn o power and input signals before inserting and removing connectors or test equipment.
Use xtures made of static-safe materials when xtures must directly contact dissipative surfaces.
Keep work area free of nonconductive materials such as ordinary plastic assembly aids and Styrofoam.
Use eld service tools, such as cutters, screwdrivers, and vacuums, that are conductive.
10 Chapter 3 Routine care, SATA drive guidelines, and disassembly preparation

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HP 280 G2 Specifications

General IconGeneral
Bus typeQPI
SteppingD1
Tjunction100 °C
Processor cache3 MB
Processor cores2
Processor modeli3-6100U
System bus rate4 GT/s
Processor familyIntel® Core™ i3
Processor seriesIntel Core i3-6100 series
Processor socketBGA 1356
Processor threads4
Processor codenameSkylake
Processor frequency2.3 GHz
Processor cache typeSmart Cache
Configurable TDP-down7.5 W
Processor lithography14 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version3.0
Processor operating modes64-bit
ECC supported by processorNo
PCI Express configurations1x4, 4x1
Thermal Design Power (TDP)15 W
Number of processors installed1
Configurable TDP-down frequency0.8 GHz
Maximum number of PCI Express lanes12
Memory types supported by processorDDR3L-SDRAM, LPDDR3-SDRAM, DDR4-SDRAM
Memory clock speeds supported by processor1866, 2133, 1600 MHz
Memory bandwidth supported by processor (max)34.1 GB/s
Maximum internal memory supported by processor32 GB
Memory slots2x DIMM
Internal memory4 GB
Memory channelsDual-channel
Memory clock speed2133 MHz
Internal memory typeDDR4-SDRAM
Memory layout (slots x size)1 x 4 GB
Ethernet LANYes
Ethernet LAN data rates10, 100, 1000 Mbit/s
USB 2.0 ports quantity6
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity0
HDD speed7200 RPM
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi
Total storage capacity500 GB
Chassis typeMicro Tower
Product colorBlack
Country of originChina
Audio chipRealtek ALC221
Product typePC
Motherboard chipsetIntel® H110
On-board graphics card ID1916
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 520
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory1.74 GB
On-board graphics card OpenGL version4.4
On-board graphics card base frequency300 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1000 MHz
Number of displays supported (on-board graphics)3
Sustainability certificatesEPEAT Silver, ENERGY STAR
Power supply180 W
Operating system installedFreeDOS
Processor codeSR2EU
Processor ARK ID88180
Processor package size42 X 24 mm
Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
Intel Secure Key Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Weight and Dimensions IconWeight and Dimensions
Depth355 mm
Width170 mm
Height358.8 mm
Weight6110 g

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