HP 280 G2 User Manual

CAUTION: To prevent loss of work and damage to the computer or drive:
If you are inserting or removing a drive, shut down the operating system properly, turn o the computer, and
unplug the power cord. Do not remove a drive while the computer is on or in standby mode.
Before handling a drive, ensure that you are discharged of static electricity. While handling a drive, avoid
touching the connector. For more information about preventing electrostatic damage, refer to Electrostatic
discharge information on page 9.
Handle a drive carefully; do not drop it.
Do not use excessive force when inserting a drive.
Avoid exposing a hard drive to liquids, temperature extremes, or products that have magnetic elds such as
monitors or speakers.
If a drive must be mailed, place the drive in a bubble-pack mailer or other protective packaging and label the
package “Fragile: Handle With Care.”
Drive positions
Item Component
1 9.5-mm slim optical drive bay
2 3.5-inch secondary hard drive bay
3 3.5-inch primary hard drive bay
NOTE: The drive conguration on your computer may be dierent than the drive conguration shown above.
To verify the type and size of the storage devices installed in the computer, run Computer Setup.
Drives 29

HP 280 G2 Specifications

General

Bus type	QPI
Stepping	D1
Tjunction	100 °C
Processor cache	3 MB
Processor cores	2
Processor model	i3-6100U
System bus rate	4 GT/s
Processor family	Intel® Core™ i3
Processor series	Intel Core i3-6100 series
Processor socket	BGA 1356
Processor threads	4
Processor codename	Skylake
Processor frequency	2.3 GHz
Processor cache type	Smart Cache
Configurable TDP-down	7.5 W
Processor lithography	14 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	3.0
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x4, 4x1
Thermal Design Power (TDP)	15 W
Number of processors installed	1
Configurable TDP-down frequency	0.8 GHz
Maximum number of PCI Express lanes	12
Memory types supported by processor	DDR3L-SDRAM, LPDDR3-SDRAM, DDR4-SDRAM
Memory clock speeds supported by processor	1866, 2133, 1600 MHz
Memory bandwidth supported by processor (max)	34.1 GB/s
Maximum internal memory supported by processor	32 GB
Memory slots	2x DIMM
Internal memory	4 GB
Memory channels	Dual-channel
Memory clock speed	2133 MHz
Internal memory type	DDR4-SDRAM
Memory layout (slots x size)	1 x 4 GB
Ethernet LAN	Yes
Ethernet LAN data rates	10, 100, 1000 Mbit/s
USB 2.0 ports quantity	6
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity	0
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Total storage capacity	500 GB
Chassis type	Micro Tower
Product color	Black
Country of origin	China
Audio chip	Realtek ALC221
Product type	PC
Motherboard chipset	Intel® H110
On-board graphics card ID	1916
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 520
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	1.74 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	300 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1000 MHz
Number of displays supported (on-board graphics)	3
Sustainability certificates	EPEAT Silver, ENERGY STAR
Power supply	180 W
Operating system installed	FreeDOS
Processor code	SR2EU
Processor ARK ID	88180
Processor package size	42 X 24 mm
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0
Intel Secure Key Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00

Weight and Dimensions

Depth	355 mm
Width	170 mm
Height	358.8 mm
Weight	6110 g