HP 280 G2 User Manual

NOTE: Single channel and unbalanced dual channel memory congurations will result in inferior graphics
performance.
●
The system will operate in single channel mode if the DIMM sockets are populated in one channel only.
●
The system will operate in a higher-performing dual channel mode if the total memory capacity of the
DIMMs in Channel A is equal to the total memory capacity of the DIMMs in Channel B. The technology and
device width can vary between the channels. For example, if Channel A is populated with two 1-GB
DIMMs and Channel B is populated with one 2-GB DIMM, the system will operate in dual channel mode.
●
The system will operate in ex mode if the total memory capacity of the DIMMs in Channel A is not equal
to the total memory capacity of the DIMMs in Channel B. In
ex mode, the channel populated with the
least amount of memory describes the total amount of memory assigned to dual channel and the
remainder is assigned to single channel. For optimal speed, the channels should be balanced so that the
largest amount of memory is spread between the two channels. If one channel will have more memory
than the other, the larger amount should be assigned to Channel A. For example, if you are populating
the sockets with one 2-GB DIMM, and three 1-GB DIMMs, Channel A should be populated with the 2-GB
DIMM and one 1-GB DIMM, and Channel B should be populated with the other two 1-GB DIMMs. With this
conguration, 4-GB will run as dual channel and 1-GB will run as single channel.
●
In any mode, the maximum operational speed is determined by the slowest DIMM in the system.
Installing DIMMs
CAUTION: You must disconnect the power cord and wait approximately 30 seconds for the power to drain
before adding or removing memory modules. Regardless of the power-on state, voltage is always supplied to
the memory modules as long as the computer is plugged into an active AC outlet. Adding or removing
memory modules while voltage is present may cause irreparable damage to the memory modules or system
board.
The memory module sockets have gold-plated metal contacts. When upgrading the memory, it is important
to use memory modules with gold-plated metal contacts to prevent corrosion and/or oxidation resulting from
having incompatible metals in contact with each other.
Static electricity can damage the electronic components of the computer or optional cards. Before beginning
these procedures, ensure that you are discharged of static electricity by
briey touching a grounded metal
object.
When handling a memory module, be careful not to touch any of the contacts. Doing so may damage the
module.
1. Prepare the computer for disassembly (Preparation for disassembly on page 17)
2. Remove the access panel (Access panel on page 18)
3. Open both latches of the memory module socket (1), and insert the memory module into the socket (2).
NOTE: A memory module can be installed in only one way. Match the notch on the module with the tab
on the memory socket.
Populate the XMM1 socket before the XMM2 socket.
Memory 23

HP 280 G2 Specifications

General

Bus type	QPI
Stepping	D1
Tjunction	100 °C
Processor cache	3 MB
Processor cores	2
Processor model	i3-6100U
System bus rate	4 GT/s
Processor family	Intel® Core™ i3
Processor series	Intel Core i3-6100 series
Processor socket	BGA 1356
Processor threads	4
Processor codename	Skylake
Processor frequency	2.3 GHz
Processor cache type	Smart Cache
Configurable TDP-down	7.5 W
Processor lithography	14 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	3.0
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x4, 4x1
Thermal Design Power (TDP)	15 W
Number of processors installed	1
Configurable TDP-down frequency	0.8 GHz
Maximum number of PCI Express lanes	12
Memory types supported by processor	DDR3L-SDRAM, LPDDR3-SDRAM, DDR4-SDRAM
Memory clock speeds supported by processor	1866, 2133, 1600 MHz
Memory bandwidth supported by processor (max)	34.1 GB/s
Maximum internal memory supported by processor	32 GB
Memory slots	2x DIMM
Internal memory	4 GB
Memory channels	Dual-channel
Memory clock speed	2133 MHz
Internal memory type	DDR4-SDRAM
Memory layout (slots x size)	1 x 4 GB
Ethernet LAN	Yes
Ethernet LAN data rates	10, 100, 1000 Mbit/s
USB 2.0 ports quantity	6
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity	0
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Total storage capacity	500 GB
Chassis type	Micro Tower
Product color	Black
Country of origin	China
Audio chip	Realtek ALC221
Product type	PC
Motherboard chipset	Intel® H110
On-board graphics card ID	1916
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 520
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	1.74 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	300 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1000 MHz
Number of displays supported (on-board graphics)	3
Sustainability certificates	EPEAT Silver, ENERGY STAR
Power supply	180 W
Operating system installed	FreeDOS
Processor code	SR2EU
Processor ARK ID	88180
Processor package size	42 X 24 mm
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0
Intel Secure Key Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00

Weight and Dimensions

Depth	355 mm
Width	170 mm
Height	358.8 mm
Weight	6110 g