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HP Compaq 2710p Maintenance And Service Guide

HP Compaq 2710p
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Packaging and transporting guidelines
Follow these grounding guidelines when packaging and transporting equipment:
To avoid hand contact, transport products in static-safe tubes, bags, or boxes.
Protect ESD-sensitive parts and assemblies with conductive or approved containers or packaging.
Keep ESD-sensitive parts in their containers until the parts arrive at static-free workstations.
Place items on a grounded surface before removing items from their containers.
Always be properly grounded when touching a component or assembly.
Store reusable ESD-sensitive parts from assemblies in protective packaging or nonconductive foam.
Use transporters and conveyors made of antistatic belts and roller bushings. Be sure that mechanized
equipment used for moving materials is wired to ground and that proper materials are selected to
avoid static charging. When grounding is not possible, use an ionizer to dissipate electric charges.
Workstation guidelines
Follow these grounding workstation guidelines:
Cover the workstation with approved static-shielding material.
Use a wrist strap connected to a properly grounded work surface and use properly grounded tools
and equipment.
Use conductive field service tools, such as cutters, screwdrivers, and vacuums.
When fixtures must directly contact dissipative surfaces, use fixtures made only of static-safe
materials.
Keep the work area free of nonconductive materials, such as ordinary plastic assembly aids and
Styrofoam.
Handle ESD-sensitive components, parts, and assemblies by the case or PCM laminate. Handle these
items only at static-free workstations.
Avoid contact with pins, leads, or circuitry.
Turn off power and input signals before inserting or removing connectors or test equipment.
Preliminary replacement requirements 33

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HP Compaq 2710p Specifications

General IconGeneral
Tjunction100 °C
FSB ParityNo
Processor cache2 MB
Processor cores2
System bus rate- GT/s
Processor familyIntel® Core™2 Duo
Processor socketLGA 3647 (Socket P)
Processor codenameMerom
Processing Die size143 mm²
Processor frequency1.33 GHz
Processor cache typeL2
Processor lithography65 nm
Processor manufacturerIntel
Processor front side bus533 MHz
Processor operating modes64-bit
Thermal Design Power (TDP)10 W
Number of Processing Die Transistors291 M
HDD speed4200 RPM
Optical drive typeDVD Super Multi
Total storage capacity120 GB
Display diagonal12.1 \
Display resolution1280 x 800 pixels
Native aspect ratio16:10
Internal memory2 GB
Memory clock speed667 MHz
Internal memory typeDDR2-SDRAM
Discrete graphics cardYes
Discrete graphics card modelIntel® GMA X3100
Maximum graphics card memory0.384 GB
TypePC
Modem speed56 Kbit/s
Dimensions (WxDxH)290 x 212 x 28.2 mm
Wireless technology802.11a/b/g/draft-n, a/b/g, b/g
Bluetooth version2.0+EDR
Operating system installedWindows Vista Business
Number of battery cells6
Serial ports quantity0
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Processor ARK ID33920
Processor package size35 x 35 mm
Country of originChina
Weight and Dimensions IconWeight and Dimensions
Depth290 mm
Width212 mm
Height28.2 mm
Weight1650 g

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