HP Compaq 2710p Maintenance And Service Guide

System board
NOTE: All system board spare part kits include replacement thermal material.
Description Spare part number
Equipped with Intel Core Duo U7600 (1.20-GHz) processor (533-MHz FSB and 2-MB L2 cache) 455083-001
Equipped with Intel Core Duo U7500 (1.06-GHz) processor (533-MHz FSB and 2-MB L2 cache) 455082-001
Equipped with Intel Celeron-M ULV processor 455081-001
Before removing the system board, follow these steps:
1.
Shut down the computer. If you are unsure whether the computer is off or in Hibernation, turn the
computer on, and then shut it down through the operating system.
2.
Disconnect all external devices connected to the computer.
3.
Disconnect the power from the computer by first unplugging the power cord from the AC outlet and
then unplugging the AC adapter from the computer.
4.
Remove the battery (see
Battery on page 37).
5.
Remove the following components:
a.
Hard drive compartment cover (see
Hard drive on page 39)
b.
Keyboard (see
Keyboard on page 48)
c.
Hinge cover (see
Hinge cover on page 50)
d.
Top cover (see
Top cover on page 52)
e.
Display assembly (see
Display assembly on page 60)
When replacing the system board, be sure that the following components are removed from the defective
system board and installed on the replacement system board:
●
SIM (see
SIM on page 38)
●
Memory modules (see
Memory module on page 47)
●
RTC battery (see
RTC battery on page 55)
●
Fan/heat sink assembly (see
Fan/heat sink assembly on page 65)
●
Modem module (see
Modem module on page 68)
Remove the system board:
1.
Position the computer with the left side toward you.
2. Press the ExpressCard slot bezel (1) to release it from the ExpressCard slot. (The ExpressCard slot
bezel is partially ejected from the ExpressCard slot.) The ExpressCard slot bezel is included in the
Plastics Kit, spare part number 454685-001.
Component replacement procedures 63

HP Compaq 2710p Specifications

General

Tjunction	100 °C
FSB Parity	No
Processor cache	2 MB
Processor cores	2
System bus rate	- GT/s
Processor family	Intel® Core™2 Duo
Processor socket	LGA 3647 (Socket P)
Processor codename	Merom
Processing Die size	143 mm²
Processor frequency	1.33 GHz
Processor cache type	L2
Processor lithography	65 nm
Processor manufacturer	Intel
Processor front side bus	533 MHz
Processor operating modes	64-bit
Thermal Design Power (TDP)	10 W
Number of Processing Die Transistors	291 M
HDD speed	4200 RPM
Optical drive type	DVD Super Multi
Total storage capacity	120 GB
Display diagonal	12.1 \
Display resolution	1280 x 800 pixels
Native aspect ratio	16:10
Internal memory	2 GB
Memory clock speed	667 MHz
Internal memory type	DDR2-SDRAM
Discrete graphics card	Yes
Discrete graphics card model	Intel® GMA X3100
Maximum graphics card memory	0.384 GB
Type	PC
Modem speed	56 Kbit/s
Dimensions (WxDxH)	290 x 212 x 28.2 mm
Wireless technology	802.11a/b/g/draft-n, a/b/g, b/g
Bluetooth version	2.0+EDR
Operating system installed	Windows Vista Business
Number of battery cells	6
Serial ports quantity	0
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Processor ARK ID	33920
Processor package size	35 x 35 mm
Country of origin	China

Weight and Dimensions

Depth	290 mm
Width	212 mm
Height	28.2 mm
Weight	1650 g