HP Compaq 2710p Maintenance And Service Guide

Table of contents
1 Product description
2 External component identification
Top components ...................................................................................................................... 6
Display components .................................................................................................. 6
Buttons, switches, and pointing devices ........................................................................ 7
Lights ....................................................................................................................... 8
Keys ...................................................................................................................... 10
Front components ................................................................................................................... 11
Rear components ................................................................................................................... 12
Right-side components ............................................................................................................ 13
Left-side components ............................................................................................................... 14
Bottom components ................................................................................................................ 15
3 Illustrated parts catalog
Serial number location ............................................................................................................ 16
Computer major components ................................................................................................... 17
Plastics Kit ............................................................................................................................. 23
Miscellaneous parts ................................................................................................................ 23
Sequential part number listing .................................................................................................. 25
4 Removal and replacement procedures
Preliminary replacement requirements ....................................................................................... 30
Tools required ......................................................................................................... 30
Service considerations ............................................................................................. 30
Plastic parts ............................................................................................. 30
Cables and connectors ............................................................................. 31
Drive handling ......................................................................................... 31
Grounding guidelines .............................................................................................. 32
Electrostatic discharge damage .................................................................. 32
Packaging and transporting guidelines ........................................ 33
Workstation guidelines .............................................................. 33
Equipment guidelines ................................................................. 34
Unknown user password .......................................................................................... 35
Component replacement procedures ........................................................................................ 36
Serial number ......................................................................................................... 36
Computer feet ......................................................................................................... 36
Battery ................................................................................................................... 37
v

HP Compaq 2710p Specifications

General

Tjunction	100 °C
FSB Parity	No
Processor cache	2 MB
Processor cores	2
System bus rate	- GT/s
Processor family	Intel® Core™2 Duo
Processor socket	LGA 3647 (Socket P)
Processor codename	Merom
Processing Die size	143 mm²
Processor frequency	1.33 GHz
Processor cache type	L2
Processor lithography	65 nm
Processor manufacturer	Intel
Processor front side bus	533 MHz
Processor operating modes	64-bit
Thermal Design Power (TDP)	10 W
Number of Processing Die Transistors	291 M
HDD speed	4200 RPM
Optical drive type	DVD Super Multi
Total storage capacity	120 GB
Display diagonal	12.1 \
Display resolution	1280 x 800 pixels
Native aspect ratio	16:10
Internal memory	2 GB
Memory clock speed	667 MHz
Internal memory type	DDR2-SDRAM
Discrete graphics card	Yes
Discrete graphics card model	Intel® GMA X3100
Maximum graphics card memory	0.384 GB
Type	PC
Modem speed	56 Kbit/s
Dimensions (WxDxH)	290 x 212 x 28.2 mm
Wireless technology	802.11a/b/g/draft-n, a/b/g, b/g
Bluetooth version	2.0+EDR
Operating system installed	Windows Vista Business
Number of battery cells	6
Serial ports quantity	0
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Processor ARK ID	33920
Processor package size	35 x 35 mm
Country of origin	China

Weight and Dimensions

Depth	290 mm
Width	212 mm
Height	28.2 mm
Weight	1650 g