HP Compaq Pro 4300 User Manual

Populating DIMM Sockets
There are two DIMM sockets on the system board: XMM1 and XMM3 with one socket per Channel.
XMM3 operates in memory channel A. XMM1 operates in memory Channel B.
The system will automatically operate in single channel mode, dual channel mode, or flex mode,
depending on how the DIMMs are installed.
●
The system will operate in single channel mode if the DIMM sockets are populated in one
channel only.
●
The system will operate in a higher-performing dual channel mode if the total memory capacity
of the DIMM in Channel A is equal to the total memory capacity of the DIMM in Channel B.
●
The system will operate in flex mode if the total memory capacity of the DIMM in Channel A is
not equal to the total memory capacity of the DIMM in Channel B. In flex mode, the channel
populated with the least amount of memory describes the total amount of memory assigned to
dual channel and the remainder is assigned to single channel. If one channel will have more
memory than the other, the larger amount should be assigned to Channel A.
● In any mode, the maximum operational speed is determined by the slowest DIMM in the system.
Installing DIMMs
CAUTION: You must disconnect the power cord and wait approximately 30 seconds for the power
to drain before adding or removing memory modules. Regardless of the power-on state, voltage is
always supplied to the memory modules as long as the computer is plugged into an active AC outlet.
Adding or removing memory modules while voltage is present may cause irreparable damage to the
memory modules or system board.
The memory module sockets have gold-plated metal contacts. When upgrading the memory, it is
important to use memory modules with gold-plated metal contacts to prevent corrosion and/or
oxidation resulting from having incompatible metals in contact with each other.
Static electricity can damage the electronic components of the computer or optional cards. Before
beginning these procedures, ensure that you are discharged of static electricity by briefly touching a
grounded metal object.
When handling a memory module, be careful not to touch any of the contacts. Doing so may damage
the module.
1. Prepare the computer for disassembly (Preparation for Disassembly on page 48).
2. Remove the access panel (
Computer Access Panel on page 50).
Installing Additional Memory 55

HP Compaq Pro 4300 Specifications

General

Full HD	No
Panel type	TN
LED backlight	Yes
Display diagonal	20 \
Display resolution	1600 x 900 pixels
Native aspect ratio	16:9
Tcase	65.3 °C
Bus type	DMI
Processor cache	3 MB
Processor cores	2
Processor model	i3-3240
System bus rate	5 GT/s
Processor family	Intel® Core™ i3
Processor series	Intel Core i3-3200 Desktop Series
Processor socket	LGA 1155 (Socket H2)
Processor threads	4
Processor codename	Ivy Bridge
Processor frequency	3.4 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor operating modes	64-bit
PCI Express configurations	1x16, 2x8
Thermal Design Power (TDP)	55 W
CPU multiplier (bus/core ratio)	34
Memory types supported by processor	DDR3-SDRAM
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	1333, 1600 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	32 GB
Product type	All-in-One PC
Motherboard chipset	Intel® H61
Internal memory	4 GB
Memory slots type	SO-DIMM
Memory clock speed	1600 MHz
Maximum internal memory	16 GB
Memory layout (slots x size)	1 x 4 GB
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Total storage capacity	500 GB
Compatible memory cards	SD
Autonomy mode	-
Storage drive interface	Serial ATA
On-board graphics card ID	0x152
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 2500
On-board graphics card family	Intel® HD Graphics
On-board graphics card base frequency	650 MHz
On-board graphics card dynamic frequency (max)	1050 MHz
Number of displays supported (on-board graphics)	3
RMS rated power	4 W
Wi-Fi standards	Not supported
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Headphone outputs	1
USB 2.0 ports quantity	6
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	0
Bundled software	Adobe Flash Player\\r HP Marketplace\\r Bing\\r Microsoft Internet Explorer\\r PDF Complete Corporate Edition\\r WinZip Basic\\r Yahoo\\r Compre Office
Recovery operating system	Windows 8 Pro
Operating system installed	Windows 7 Professional
Processor ARK ID	65690
Processor package size	37.5 x 37.5 mm
Supported instruction sets	AVX, SSE4.1, SSE4.2
Thermal solution specification	PCG 2011C
Intel Secure Key Technology version	0.00
Intel Identity Protection Technology version	1.00
Product color	Black
Country of origin	China
Total megapixels	1.3 MP
AC adapter power	150 W
Operating temperature (T-T)	5 - 35 °C
Operating relative humidity (H-H)	15 - 80 %
Sustainability certificates	ENERGY STAR

Weight and Dimensions

Depth (with stand)	220 mm
Width (with stand)	507 mm
Height (with stand)	406 mm
Weight (with stand)	5730 g