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HP EliteBook 850 G4 User Manual

HP EliteBook 850 G4
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Grounding guidelines
Electrostatic discharge damage
Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure determine
the degree of sensitivity. Networks built into many integrated circuits provide some protection, but in many
cases, ESD contains enough power to alter device parameters or melt silicon junctions.
A discharge of static electricity from a nger or other conductor can destroy static-sensitive devices or
microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.
An electronic device exposed to ESD may not be aected at all and can work perfectly throughout a normal
cycle. Or the device may function normally for a while, then degrade in the internal layers, reducing its life
expectancy.
CAUTION: To prevent damage to the computer when you are removing or installing internal components,
observe these precautions:
Keep components in their electrostatic-safe containers until you are ready to install them.
Before touching an electronic component, discharge static electricity by using the guidelines described in this
section.
Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
The following table shows how humidity aects the electrostatic voltage levels generated by dierent
activities.
CAUTION: A product can be degraded by as little as 700 V.
Typical electrostatic voltage levels
Relative humidity
Event 10% 40% 55%
Walking across carpet 35,000 V 15,000 V 7,500 V
Walking across vinyl oor 12,000 V 5,000 V 3,000 V
Motions of bench worker 6,000 V 800 V 400 V
Removing DIPS from plastic tube 2,000 V 700 V 400 V
Removing DIPS from vinyl tray 11,500 V 4,000 V 2,000 V
Removing DIPS from Styrofoam 14,500 V 5,000 V 3,500 V
Removing bubble pack from PCB 26,500 V 20,000 V 7,000 V
Packing PCBs in foam-lined box 21,000 V 11,000 V 5,000 V
Grounding guidelines 31

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HP EliteBook 850 G4 Specifications

General IconGeneral
Form factorClamshell
Product typeLaptop
Product colorSilver
Country of originChina
Bus typeOPI
SteppingH0
Tjunction100 °C
Processor cache3 MB
Processor cores2
Processor modeli5-7200U
System bus rate4 GT/s
Processor familyIntel® Core™ i5
Processor socketBGA 1356
Processor threads4
Processor codenameKaby Lake
Configurable TDP-up25 W
Processor frequency2.5 GHz
Processor cache typeSmart Cache
Configurable TDP-down7.5 W
Processor lithography14 nm
Processor manufacturerIntel
PCI Express slots version3.0
Processor boost frequency3.1 GHz
Processor operating modes64-bit
ECC supported by processorNo
PCI Express configurations1x2+2x1, 1x4, 2x2, 4x1
Thermal Design Power (TDP)15 W
Configurable TDP-up frequency2.7 GHz
Configurable TDP-down frequency0.8 GHz
Maximum number of PCI Express lanes12
Numeric keypadYes
Pointing deviceTouchpad
Memory slots2x SO-DIMM
Internal memory8 GB
Memory clock speed2133 MHz
Internal memory typeDDR4-SDRAM
Maximum internal memory32 GB
Memory layout (slots x size)1 x 8 GB
SSD capacityThe Solid State Drive's storage capacity in Gigabytes.
SSD interfacePCI Express
Storage mediaSSD
Total storage capacity256 GB
Compatible memory cardsSD, SDHC, SDXC
Number of SSDs installed1
Display diagonal15.6 \
Native aspect ratio16:9
On-board graphics card ID0x5916
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 620
On-board graphics card familyIntel® HD Graphics
On-board graphics card OpenGL version4.4
On-board graphics card base frequency300 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1000 MHz
Battery capacity51 Wh
Battery life (max)14.7 h
Number of battery cells3
AC adapter power45 W
Wi-Fi standards802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version4.2
Top Wi-Fi standardWi-Fi 5 (802.11ac)
Ethernet LAN data rates10, 100, 1000 Mbit/s
Charging port typeDC-in jack
USB 2.0 ports quantity0
Sustainability certificatesENERGY STAR
Processor codeSR2ZU
Processor ARK ID95443
Processor package size42 x 24 mm
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Intel Identity Protection Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Intel segment taggingHome Office, Small Business
HP segmentBusiness
HP Management toolsHP Driver Packs, HP SoftPaq Download Manager (SDM), HP System Software Manager (SSM), HP BIOS Config Utility (BCU), HP Client Catalog, HP Management Integration Kit, HP Device Access Manager, HP BIOSphere, HP Sure Start, HP Client Security
HP Software providedHP ePrint Driver+JetAdvantage, HP Hotkey Support, HP Noise Cancellation, HP Workwise, HP Velocity
Harmonized System (HS) code84713000
Weight and Dimensions IconWeight and Dimensions
Depth257.7 mm
Width383.6 mm
Height19.4 mm
Weight1840 g

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