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HP OMEN 17 User Manual

HP OMEN 17
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Table 4-1 Static electricity occurrence based on activity and humidity (continued)
Relative humidity
Event 55% 40% 10%
Walking across vinyl oor
Motions of bench worker
Removing DIPs (dual in-line packages) from plastic tube
3,000 V
400 V
400 V
5,000 V
800 V
700 V
12,000 V
6,000 V
2,000 V
Removing DIPs from vinyl tray
Removing DIPs from polystyrene foam
Removing bubble pack from PCB (printed circuit board)
Packing PCBs in foam-lined box
2,000 V
3,500 V
7,000 V
5,000 V
4,000 V
5,000 V
20,000 V
11,000 V
11,500 V
14,500 V
26,500 V
21,000 V
Multiple electric components can be packaged together in plastic tubes, trays, or polystyrene foam.
NOTE: As little as 700 V can degrade a product.
Preventing electrostatic damage to equipment
Many electronic components are sensitive to ESD. Circuitry design and structure determine the degree of
sensitivity. The following packaging and grounding precautions are necessary to prevent static electricity
damage to electronic components.
To avoid hand contact, transport products in static-safe containers such as tubes, bags, or boxes.
Protect all electrostatic parts and assemblies with conductive or approved containers or packaging.
Keep electrostatic-sensitive parts in their containers until they arrive at static-free stations.
Place items on a grounded surface before removing them from their container.
Always be properly grounded when touching a sensitive component or assembly.
Avoid contact with pins, leads, or circuitry.
Place reusable electrostatic-sensitive parts from assemblies in protective packaging or conductive
f
oam.
Personal grounding methods and equipment
Using certain equipment can prevent static electricity damage to electronic components.
Wrist straps
are exible straps with a maximum of 1 MΩ ±10% resistance in the ground cords. To
provide proper ground, a strap must be worn snug against bare skin. The ground cord must be
connected and t snugly into the banana plug connector on the grounding mat or workstation.
Heel straps/Toe straps/Boot straps
can be used at standing workstations and are compatible with
most types of shoes or boots. On conductive oors or dissipative oor mats, use them on both feet with
a maximum of 1 MΩ ±10% resistance between the operator and ground.
Electrostatic discharge information 23

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HP OMEN 17 Specifications

General IconGeneral
Form factorClamshell
Product typeLaptop
Product colorBlack, Carbon, Red
Country of originChina
Market positioningGaming
Internal memory8 GB
Memory clock speed2133 MHz
Internal memory typeDDR4-SDRAM
Maximum internal memory16 GB
Memory layout (slots x size)2 x 4 GB
HDD speed7200 RPM
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi
Card reader integratedYes
Total storage capacity1000 GB
Compatible memory cardsSD
Number of HDDs installed1
Display surfaceMatt
Display diagonal17.3 \
Native aspect ratio16:9
On-board graphics card ID0x191B
Discrete graphics card modelNVIDIA® GeForce® GTX 960M
On-board graphics card modelIntel® HD Graphics 530
Discrete graphics card memory2 GB
Discrete graphics memory typeGDDR5
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory1.7 GB
On-board graphics card OpenGL version4.4
On-board graphics card base frequency350 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)950 MHz
Speakers manufacturerBang & Olufsen
Number of built-in speakers2
Wi-Fi standardsWi-Fi 5 (802.11ac)
Bluetooth version4.2
Ethernet LAN data rates10, 100, 1000 Mbit/s
Charging port typeDC-in jack
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
VGA (D-Sub) ports quantity0
Sustainability certificatesEPEAT Silver, ENERGY STAR
Cable lock slot typeKensington
Password protection typePower on
AC adapter power120 W
Battery capacity62 Wh
Number of battery cells6
Keyboard layoutQWERTY
Pointing deviceTouchpad
Bus typeDMI3
SteppingR0
Tjunction100 °C
Processor cache6 MB
Processor cores4
Processor modeli5-6300HQ
System bus rate8 GT/s
Processor familyIntel® Core™ i5
Processor seriesIntel® Core™ i5-6300 Mobile Series
Processor socketBGA 1440
Processor codenameSkylake
Processor frequency2.3 GHz
Processor cache typeSmart Cache
Configurable TDP-down35 W
Processor lithography14 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version3.0
Processor boost frequency3.2 GHz
Processor operating modes64-bit
PCI Express configurations1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)45 W
Maximum number of PCI Express lanes16
Processor codeSR2FP
Processor ARK ID88959
Processor package size42 x 28 mm
Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
Intel Secure Key Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Weight and Dimensions IconWeight and Dimensions
Depth279 mm
Width416 mm
Height29.9 mm
Weight2750 g

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