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HP OMEN 17 User Manual

HP OMEN 17
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Table 4-2 Static shielding protection levels
Static shielding protection levels
Method Voltage
Antistatic plastic
Carbon-loaded plastic
Metallized laminate
1,500
7,500
15,000
Grounding the work area
To prevent static damage at the work area, follow these precautions.
Cover the work surface with approved static-dissipative material.
Use a wrist strap connected to a properly grounded work surface and use properly grounded tools and
equipmen
t.
Use static-dissipative mats, foot straps, or air ionizers to give added protection.
Handle electrostatic sensitive components, parts, and assemblies by the case or PCB laminate. Handle
them onl
y at static-free work areas.
Turn
o power and input signals before inserting and removing connectors or test equipment.
Use
xtures made of static-safe materials when xtures must directly contact dissipative surfaces.
Keep the work area free of nonconductive materials, such as ordinary plastic assembly aids and
pol
ystyrene foam.
Use conductive
eld service tools, such as cutters, screwdrivers, and vacuums.
Avoid contact with pins, leads, or circuitry.
Recommended materials and equipment
HP recommends certain materials and equipment to prevent static electricity.
Antistatic tape
Antistatic smocks, aprons, or sleeve protectors
Conductive bins and other assembly or soldering aids
Conductive foam
Conductive tabletop workstations with ground cord of 1 MΩ ±10% resistance
Static-dissipative table or oor mats with hard tie to ground
Field service kits
Static awareness labels
Wrist straps and footwear straps providing 1 MΩ ±10% resistance
Material handling packages
Conductive plastic bags
Conductive plastic tubes
24 Chapter 4 Removal and replacement procedures preliminary requirements

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HP OMEN 17 Specifications

General IconGeneral
Form factorClamshell
Product typeLaptop
Product colorBlack, Carbon, Red
Country of originChina
Market positioningGaming
Internal memory8 GB
Memory clock speed2133 MHz
Internal memory typeDDR4-SDRAM
Maximum internal memory16 GB
Memory layout (slots x size)2 x 4 GB
HDD speed7200 RPM
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi
Card reader integratedYes
Total storage capacity1000 GB
Compatible memory cardsSD
Number of HDDs installed1
Display surfaceMatt
Display diagonal17.3 \
Native aspect ratio16:9
On-board graphics card ID0x191B
Discrete graphics card modelNVIDIA® GeForce® GTX 960M
On-board graphics card modelIntel® HD Graphics 530
Discrete graphics card memory2 GB
Discrete graphics memory typeGDDR5
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory1.7 GB
On-board graphics card OpenGL version4.4
On-board graphics card base frequency350 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)950 MHz
Speakers manufacturerBang & Olufsen
Number of built-in speakers2
Wi-Fi standardsWi-Fi 5 (802.11ac)
Bluetooth version4.2
Ethernet LAN data rates10, 100, 1000 Mbit/s
Charging port typeDC-in jack
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
VGA (D-Sub) ports quantity0
Sustainability certificatesEPEAT Silver, ENERGY STAR
Cable lock slot typeKensington
Password protection typePower on
AC adapter power120 W
Battery capacity62 Wh
Number of battery cells6
Keyboard layoutQWERTY
Pointing deviceTouchpad
Bus typeDMI3
SteppingR0
Tjunction100 °C
Processor cache6 MB
Processor cores4
Processor modeli5-6300HQ
System bus rate8 GT/s
Processor familyIntel® Core™ i5
Processor seriesIntel® Core™ i5-6300 Mobile Series
Processor socketBGA 1440
Processor codenameSkylake
Processor frequency2.3 GHz
Processor cache typeSmart Cache
Configurable TDP-down35 W
Processor lithography14 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version3.0
Processor boost frequency3.2 GHz
Processor operating modes64-bit
PCI Express configurations1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)45 W
Maximum number of PCI Express lanes16
Processor codeSR2FP
Processor ARK ID88959
Processor package size42 x 28 mm
Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
Intel Secure Key Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Weight and Dimensions IconWeight and Dimensions
Depth279 mm
Width416 mm
Height29.9 mm
Weight2750 g

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