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HP OMEN 17 User Manual

HP OMEN 17
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Caring for wood veneer (select products only)
Your product might feature high-quality wood veneer. As with all natural wood products, proper care is
important for best results over the life of the product. Because of the nature of natural wood, you might see
unique variations in the grain pattern or subtle variations in color, which are normal.
Clean the wood with a dry, static-free microber cloth or chamois.
Avoid cleaning products containing substances such as ammonia, methylene chloride, acetone,
tur
pentine, or other petroleum-based solvents.
Do not expose the wood to sun or moisture for long periods of time.
If the wood becomes wet, dry it by dabbing with an absorbent, lint-free cloth.
Avoid contact with any substance that might dye or discolor the wood.
Avoid contact with sharp objects or rough surfaces that might scratch the wood.
See Removing dirt and debris from your computer on page 25 for the recommended steps to clean the high-
t
ouch, external surfaces on your computer. After you remove the dirt and debris, you can also clean the
surfaces with a disinfectant. See
Cleaning your computer with a disinfectant on page 26 for sanitizing
guideline
s to help prevent the spread of harmful bacteria and viruses.
Packaging and transporting guidelines
Follow these grounding guidelines when packaging and transporting equipment.
To avoid hand contact, transport products in static-safe tubes, bags, or boxes.
Protect ESD-sensitive parts and assemblies with conductive or approved containers or packaging.
Keep ESD-sensitive parts in their containers until the parts arrive at static-free workstations.
Place items on a grounded surface before removing items from their containers.
Always be properly grounded when touching a component or assembly.
Store reusable ESD-sensitive parts from assemblies in protective packaging or nonconductive foam.
Use transporters and conveyors made of antistatic belts and roller bushings. Be sure that mechanized
equipmen
t used for moving materials is wired to ground and that proper materials are selected to avoid
static charging. When grounding is not possible, use an ionizer to dissipate electric charges.
Accessing support information
Use this information to nd the HP support that you need.
Table 4-3 Support information locations
Service consideration Path to access information
Records of reported failure incidents stored
on the c
omputer
Windows:
Pre-operating system failures are logged in the BIOS Event Log. To view the BIOS
Ev
ent Log:
1. Press the power button.
2. Immediately and repeatedly press
esc when the power button light turns white.
Packaging and transporting guidelines 27

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HP OMEN 17 Specifications

General IconGeneral
Form factorClamshell
Product typeLaptop
Product colorBlack, Carbon, Red
Country of originChina
Market positioningGaming
Internal memory8 GB
Memory clock speed2133 MHz
Internal memory typeDDR4-SDRAM
Maximum internal memory16 GB
Memory layout (slots x size)2 x 4 GB
HDD speed7200 RPM
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi
Card reader integratedYes
Total storage capacity1000 GB
Compatible memory cardsSD
Number of HDDs installed1
Display surfaceMatt
Display diagonal17.3 \
Native aspect ratio16:9
On-board graphics card ID0x191B
Discrete graphics card modelNVIDIA® GeForce® GTX 960M
On-board graphics card modelIntel® HD Graphics 530
Discrete graphics card memory2 GB
Discrete graphics memory typeGDDR5
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory1.7 GB
On-board graphics card OpenGL version4.4
On-board graphics card base frequency350 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)950 MHz
Speakers manufacturerBang & Olufsen
Number of built-in speakers2
Wi-Fi standardsWi-Fi 5 (802.11ac)
Bluetooth version4.2
Ethernet LAN data rates10, 100, 1000 Mbit/s
Charging port typeDC-in jack
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
VGA (D-Sub) ports quantity0
Sustainability certificatesEPEAT Silver, ENERGY STAR
Cable lock slot typeKensington
Password protection typePower on
AC adapter power120 W
Battery capacity62 Wh
Number of battery cells6
Keyboard layoutQWERTY
Pointing deviceTouchpad
Bus typeDMI3
SteppingR0
Tjunction100 °C
Processor cache6 MB
Processor cores4
Processor modeli5-6300HQ
System bus rate8 GT/s
Processor familyIntel® Core™ i5
Processor seriesIntel® Core™ i5-6300 Mobile Series
Processor socketBGA 1440
Processor codenameSkylake
Processor frequency2.3 GHz
Processor cache typeSmart Cache
Configurable TDP-down35 W
Processor lithography14 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version3.0
Processor boost frequency3.2 GHz
Processor operating modes64-bit
PCI Express configurations1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)45 W
Maximum number of PCI Express lanes16
Processor codeSR2FP
Processor ARK ID88959
Processor package size42 x 28 mm
Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
Intel Secure Key Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Weight and Dimensions IconWeight and Dimensions
Depth279 mm
Width416 mm
Height29.9 mm
Weight2750 g

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