HP TOUCHSMART TM2 User Manual

8 Power management
Shutting down the computer
CAUTION: Unsaved information will be lost when the computer is shut down.
The Shut down command closes all open programs, including the operating system, and then turns off
the display and computer.
Shut down the computer under any of the following conditions:
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When you need to replace the battery or access components inside the computer
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When you are connecting an external hardware device that does not connect to a USB port
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When the computer will be unused and disconnected from external power for an extended period
Although you can shut down the computer with the power switch, the recommended procedure is to use
the Windows Shut down command.
To shut down the computer:
NOTE: If the computer is in the Sleep state or in Hibernation, you must first exit Sleep or Hibernation
before shutdown is possible.
1. Save your work and close all open programs.
2. Click Start.
3. Click Shut down.
If the computer is unresponsive and you are unable to use the preceding shutdown procedures, try the
following emergency procedures in the sequence provided:
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Press ctrl+alt+delete, and then click the Power button.
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Slide and hold the power switch for at least 5 seconds.
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Disconnect the computer from external power and remove the battery.
Setting power devices
Using power-saving states
The computer has two power-saving states enabled at the factory: Sleep and Hibernation.
When Sleep is initiated, the power light blinks and the screen clears. Your work is saved to memory,
letting you exit Sleep faster than exiting Hibernation. If the computer is in the Sleep state for an extended
period or if the battery reaches a critical battery level while in the Sleep state, the computer initiates
Hibernation.
When Hibernation is initiated, your work is saved to a hibernation file on the hard drive and the computer
turns off.
42 Chapter 8 Power management
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HP TOUCHSMART TM2 Specifications

General

Bus type	DMI
Stepping	K0
Tjunction	105 °C
Processor cache	3 MB
Processor cores	2
System bus rate	2.5 GT/s
Processor family	Intel® Core™ i3
Processor series	Intel Core i3-300 Mobile Series
Processor socket	BGA 1288
Processor threads	4
Processor codename	Arrandale
Processing Die size	81 mm²
Processor frequency	1.33 GHz
Processor cache type	Smart Cache
Processor lithography	32 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	2.0
Processor boost frequency	The turbo boost is an automatic, managed accelleration of the processor when one of the cores is overloaded.
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16
Thermal Design Power (TDP)	18 W
CPU multiplier (bus/core ratio)	10
Maximum number of PCI Express lanes	16
Number of Processing Die Transistors	382 M
Motherboard chipset	Intel® HM55 Express
Internal memory	3 GB
Internal memory type	DDR3-SDRAM
Maximum internal memory	8 GB
Memory layout (slots x size)	1 x 1 + 1 x 2 GB
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi DL
Card reader integrated	Yes
Total storage capacity	320 GB
Compatible memory cards	Memory Stick (MS), MMC, MS PRO, SD, xD
Number of HDDs installed	1
Display diagonal	12.1 \
Touch technology	Multi-touch
Display resolution	1280 x 800 pixels
Native aspect ratio	16:10
Ethernet interface type	Gigabit Ethernet
Operating temperature (T-T)	41 - 95 °F
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics
On-board graphics card base frequency	166 MHz
On-board graphics card dynamic frequency (max)	500 MHz
Audio system	Dolby Advanced
Speakers manufacturer	Altec Lansing
Wi-Fi standards	802.11b, 802.11g, Wi-Fi 4 (802.11n)
Cabling technology	10/100/1000Base-T(X)
Networking features	Gigabit LAN, WLAN
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Charging port type	DC-in jack
USB 2.0 ports quantity	3
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	0
Keyboard layout	-
Pointing device	Clickpad
Operating system installed	Windows 7 Home Premium
Form factor	Convertible (Swivel)
Product type	Hybrid (2-in-1)
Country of origin	China
Battery life (max)	- h
Number of battery cells	6
AC adapter power	65 W
Cable lock slot type	Kensington
Operating altitude	-15 - 3048 m
Non-operating altitude	-15 - 12192 m
Storage temperature (T-T)	-20 - 60 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %
Processor code	SLBSL
Processor ARK ID	50028
Processor package size	BGA 34 x 28 mm
Graphics & IMC lithography	45 nm
Supported instruction sets	SSE4.1, SSE4.2

Weight and Dimensions

Depth	326 mm
Width	230 mm
Weight	1893 g
Height (rear)	30 mm
Height (front)	24.3 mm