Quectel SC200E Series User Manual

Smart Module Series
SC200E_Series_Hardware_Design 106 / 115
Table 60: Recommended Thermal Profile Parameters
1. If a conformal coating is necessary for the module, do NOT use any coating material that may
chemically react with the PCB or shielding cover, and prevent the coating material from flowing into
the module.
2. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the
module.
3. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for
any situation that you are not sure about, or any process (e.g., selective soldering, ultrasonic
soldering) that is not mentioned in document [4].
Factor
Recommendation
Soak Zone
Max slope
1–3 °C/s
Soak time (between A and B: 150 °C and 200 °C)
70–120 s
Reflow Zone
Max slope
1–3 °C/s
Reflow time (D: over 217 °C)
40–70 s
Max temperature
235 °C to 246 °C
Cooling down slope
-1.5 to -3 °C/s
Reflow Cycle
Max reflow cycle
1
NOTE

Quectel SC200E Series Specifications

General

Brand	Quectel
Model	SC200E Series
Category	GSM/GPRS Modules
Language	English