Theory of Operation
Display Panel
Waveforms and m
enus are displayed on a color, active-matrix LCD display with
touch panel.
Display System. Text and menu image information from the Windows system is
merged with the waveform images and processed by the display circuitry. The
display sy
stem sends the combined graphical image to the active-matrix LCD
display.
Touch Panel. The touch information from the touch screen is process ed by a
Windows driver, actively placing the pointer at the touched location. Actions from
amous
e and actions from the touch panel are interchangeable, and treated alike
by the user interface software.
Front Panel
The Front-panel board takes input from buttons and knobs and controls the status
LEDs. The Front-panel board communicates to the Main board and to the host
through an IIC interface. A microcontroller on the Front-panel board performs all
of the I/O functions. The Front-panel board interacts with and provides power for
the probes, through the VPI interface. The Fr ont-panel board also generates probe
calibration and compensation signals.
Power. The power switch in the lower left corner of the instrument front is
connected via a flex circuit to the Front-panel board, which, in turn, controls the
off-line power supply system. This allows Windows to control the power based
on standard Windows operating behavior.
COM-E Interface Board
The COM-E Interface board implements the PC I/O functions, such as USB, PS/2,
VGA, and Audio. This board also routes
the PCIe interface to the Main board for
the acquisition system. The instrument hard drive connects directly to this board.
The Interface board takes bulk 12 volts power from the power supply and routes it
to the Main board. External VPI power is routed through this board, as are the Ref
In, Aux Out, and USB device ports. The 5 volt and 3.3 volt local switching power
supplies are located on this board. A microcontroller controls power sequencing
and power supply monitoring. This
microcontroller communicates to devices on
the Main board through the IIC interface.
The COM-E Interface board is a carrier board for a COM-E mo
dule.
COM-E Module. This module implements the PC that is integrated into the
instrument. This module connects to the COM-E Interface board. The module
contains the CPU, Memory, and Peripheral Controller Hubs (such as PCH, North
Bridge, and/or South Bridge). The module conforms t
o the COM-E specification
maintained by the PCMIG consortium with a Type-2 connector system. The
module is connected to the system through two board-to-board 220-pin mezzanine
connectors. The power, PCIe, USB, and video connect to the COM-E Interface
board through this connector. A high-performance heat sink cools the main
heat-generating devices on this board.
MSO70000/C, DSA70000B/C, DPO70000B/C, D PO7000, MSO5000, DPO5000 Series 2–11
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