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Xerox Phaser 3250 Service Manual

Xerox Phaser 3250
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vi Phaser 3250 Laser Printer Service Manual
Electrostatic Discharge Precautions
Some semiconductor components, and the respective sub-assemblies that
contain them, are vulnerable to damage by Electrostatic Discharge (ESD).
These components include Integrated Circuits (ICs), Large-Scale Integrated
circuits (LSIs), field-effect transistors, and other semiconductor chip
components. The following techniques will reduce the occurrence of
component damage caused by static electricity.
Be sure the power is Off to the chassis or circuit board, and observe all other
safety precautions.
Immediately before handling any semiconductor components assemblies,
drain the electrostatic charge from your body. This can be accomplished
by touching an earth ground source or by wearing a wrist strap device
connected to an earth ground source. Wearing a wrist strap will also
prevent accumulation of additional bodily static charges. Be sure to
remove the wrist strap before applying power to the unit under test to
avoid potential shock.
After removing a static sensitive assembly from its anti-static bag, place it
on a grounded conductive surface. If the anti-static bag is conductive, you
may ground the bag and use it as a conductive surface.
Do not use freon-propelled chemicals. These can generate electrical
charges sufficient to damage some devices.
Do not remove a replacement component or electrical sub-assembly from
its protective package until you are ready to install it.
Immediately before removing the protective material from the leads of a
replacement device, touch the protective material to the chassis or circuit
assembly into which the device will be installed.
Minimize body motions when handling unpacked replacement devices.
Motion such as your clothes brushing together, or lifting a foot from a
carpeted floor can generate enough static electricity to damage an
electro-statically sensitive device.
Handle IC’s and Erasable Programmable Read-Only Memories
(EPROM’s) carefully to avoid bending pins.
Pay attention to the direction of parts when mounting or inserting them on
Printed Circuit Boards (PCB’s).

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Xerox Phaser 3250 Specifications

General IconGeneral
ColorNo
Print technologyLaser
Maximum resolution600 x 600 DPI
Warm-up time (from sleep mode)15 s
Time to first page (black, normal)8.5 s
Print speed (black, normal quality, A4/US Letter)28 ppm
Internal memory32 MB
Maximum internal memory160 MB
Sound power level (standby)29 dB
Sound pressure level (printing)54 dB
Total input capacity251 sheets
Maximum input capacity501 sheets
Paper tray media typesBond paper, Envelopes, Labels, Plain paper, Recycled paper, Transparencies
FunctionsPrint
I/O portsUSB 2.0
Device managerPrinter Setting Utility for Windows
Package length561.33 mm
Depth (imperial)14.5 \
Width (imperial)14.3 \
Height (imperial)9.4 \
Weight (imperial)26.19 lbs
Power requirements240 V, 50/60 Hz
Storage drive typeN/A
Hardware scan resolution1200 x 1200 DPI
Storage temperature (T-T)32 - 104 °F
Power consumption (active)400 W
Compatible operating systemsFedora Core 1, Red Hat 9, SUSE 9 Windows 2000/Vista
Non-operating relative humidity (non-condensing)20 - 80 %
Country of originChina
Maximum duty cycle30000 pages per month
Recommended duty cycle4000 pages per month
Sustainability certificatesENERGY STAR
Power consumption (standby)70 W
Power consumption (PowerSave)11 W
Operating temperature (T-T)10 - 32 °C
Operating relative humidity (H-H)10 - 80 %
CertificationCE, UL 60950-1/CSA 60950-1-03, EMC 2004/108/EC, 2006/95/EC
Package width472.43 mm
Package height342.89 mm
Package weight11884.3 g
Weight and Dimensions IconWeight and Dimensions
Depth369 mm
Width364 mm
Height239.2 mm
Dimensions (WxDxH)364 x 369 x 239.2 mm

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