Dell PowerEdge 2950 Information Update

Information Update 19
System Setup Program Update
Memory Screen
Table 1-3 lists the descriptions for the information fields that appear
on the Memory Information screen.
Table 1-3. Memory Information Screen Options
Option Description
System Memory Size Displays the amount of system memory.
System Memory Type Displays the type of system memory.
System Memory Speed Displays the system memory speed.
Video Memory Displays the amount of video memory.
System Memory Testing Specifies whether system memory tests are run at system
boot. Options are Enabled and Disabled.
Redundant Memory
(Disabled default)
Enables or disables the redundant memory feature.
When set to Spare Mode, the first rank of memory on
each DIMM is reserved for memory sparing. Redundant
memory feature is disabled if the Node Interleaving field
is enabled.
Node Interleaving
(Disabled default)
If this field is set to Enabled, memory interleaving is
supported if a symmetric memory configuration is
installed. If this field is set to Disabled, the system can
support Non-Uniform Memory architecture (NUMA)
(asymmetric) memory configurations.
NOTE: The Node Interleaving field must be set to Disabled
when using the redundant memory feature.
Low Power Mode
(Disabled default)
Enables or disables the low power mode of the memory.
When set to Disabled, the memory runs at full speed.
When set to Enabled, the memory runs at a reduced
speed to conserve energy.

Dell PowerEdge 2950 Specifications

General

Tcase	67 °C
Bus type	FSB
Stepping	E0
FSB Parity	Yes
Processor code	SLBBP
Processor cache	12 MB
Processor cores	4
Processor model	E5405
System bus rate	- GT/s
Processor series	Intel Xeon 5400 Series
Processor socket	LGA 771 (Socket J)
Processor codename	Harpertown
Motherboard chipset	Intel® 5000X
Processing Die size	214 mm²
Processor frequency	2 GHz
Processor cache type	L2
Processor lithography	45 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	1333 MHz
Processor operating modes	64-bit
ECC supported by processor	No
Thermal Design Power (TDP)	80 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	6
Number of Processing Die Transistors	820 M
HDD size	3.5 \
HDD capacity	160 GB
HDD interface	Serial ATA
Total storage capacity	3320 GB
Maximum storage capacity	6 TB
Graphics card	ES1000
Memory slots	8x DIMM
Internal memory	4 GB
Memory clock speed	667 MHz
Internal memory type	DDR2-SDRAM
Maximum internal memory	64 GB
Memory layout (slots x size)	2 x 2 GB
Maximum graphics card memory	16 MB
Networking features	Broadcom NetXtreme IITM 5708 Gigabit5 Ethernet NIC
Supported network protocols	TOE (TCP/IP)
Other network protocols supported	iSCSI Boot
PS/2 ports quantity	0
USB 2.0 ports quantity	5
Bundled software	Symantec Backup ExecTM 12.5 Symantec Backup ExecTM System Recovery 8.5 CommVault 7.0 Vizioncore
Compatible operating systems	Microsoft Windows Server 2008, Microsoft Windows Server 2003 Red Hat Linux Enterprise SUSE Linux Enterprise Server 10 x86-64 VMware ESX 3.5
Chassis type	Rack (2U)
Storage temperature (T-T)	-40 - 65 °C
Operating temperature (T-T)	10 - 35 °C
Storage relative humidity (H-H)	-40 - 65 %
Operating relative humidity (H-H)	20 - 80 %
Certification	FCC (U.S. only) Class A ICES (Canada) Class B CE Mark (EN 55022 Class B, EN55024, EN61000-3-2, EN61000-3-3) VCCI (Japan) Class B BSMI (Taiwan) Class A C-Tick (Australia/New Zealand) Class B SABS (South Africa) Class B CCC (China) Class B MIC (Korea) Class B UL 60950 CAN/CSA C22.2 No. 60950 EN 60950 IEC 60950
Processor ARK ID	33079

Weight and Dimensions

Depth	744 mm
Width	444.3 mm
Height	86.4 mm
Weight	23000 g