Dell PowerEdge R510 User Manual

122 Installing System Components
5 Press down and out on the ejectors on each end of the socket until the
memory module pops out of the socket. See Figure 3-19.
Handle each memory module only on either card edge, making sure not to
touch the middle of the memory module.
6 Replace the cooling shroud. See "Installing the Cooling Shroud" on
page 91.
7 Close the system. See "Closing the System" on page 89.
8 Reconnect the system and peripherals to their power sources, and turn
them on.
Expansion Cards and Expansion-Card Risers
Your system supports up to four PCI Express (PCIe) expansion cards installed
in connectors on an
expansion-card riser.
Depending on the configuration, your system may have either riser 1 or
riser 2:
• Expansion-card riser 1 provides three x4 Gen2 PCIe expansion-card slots
and one x8 Gen2 PCIe expansion-card slot.
• Expansion-card riser 2 provides one x4 Gen2 PCIe expansion-card slot and
one x16 Gen2 PCIe expansion-card slot.
CAUTION: Expansion cards can only be installed in the slots on the
expansion-card riser. Do not attempt to install expansion cards directly into
the riser connector on the system board.
Expansion Card Installation Guidelines
• The expansion-card slots support full-height, half-length cards.
• The expansion-card slots are hot-swappable.
• PCI Express Generation 2 expansion cards are supported in all the slots.
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Dell PowerEdge R510 Specifications

General

HDD size	3.5 \
Hot-swap	Yes
HDD capacity	450 GB
HDD interface	Serial Attached SCSI (SAS)
Total storage capacity	900 GB
Number of HDDs installed	2
Number of HDDs supported	8
Internal memory	4 GB
Memory clock speed	1066 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	64 GB
Tcase	76 °C
Bus type	QPI
Stepping	D0
FSB Parity	No
Processor code	SLBF6
Processor cache	8 MB
Processor cores	4
Processor model	E5540
System bus rate	5.86 GT/s
Processor series	Intel Xeon 5500 Series
Processor socket	Socket B (LGA 1366)
Processor codename	Nehalem EP
Motherboard chipset	Intel® 5500
Processing Die size	263 mm²
Processor frequency	2.53 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor system type	DP
Processor manufacturer	Intel
Processor package size	42.5 x 45 mm
Processor front side bus	- MHz
Processor boost frequency	2.8 GHz
Processor operating modes	64-bit
Thermal Design Power (TDP)	80 W
CPU multiplier (bus/core ratio)	19
Number of Processing Die Transistors	731 M
Memory channels supported by processor	Triple
Memory clock speeds supported by processor	800, 1066 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	144 GB
PS/2 ports quantity	0
Serial ports quantity	1
USB 2.0 ports quantity	6
Display	LCD
L1 cache	0.064 MB
Form factor	-
Graphics card	G200eW
Dimensions (WxDxH)	86.4 x 436.6 x 609.6 mm
Compatible operating systems	Microsoft Windows Small Business Server 2008/2003/ Novell SUSE Linux Enterprise Server 11/10 SP2 Linux Red Hat Enterprise 5.3/4.7 VMware vSphere Version 4.0 VMware ESX v3.5 / ESXi v3.5
Power consumption (typical)	1100 W
Noise level	42 dB
Chassis type	Rack (2U)
PCI Express x4 slots	3
Processor ARK ID	37104
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Weight	13500 g