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Dell PowerEdge R510 User Manual

Dell PowerEdge R510
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Installing System Components 139
3
Open the system. See "Opening the System" on page 87.
4
Remove the cooling shroud. See "Removing the Cooling Shroud" on
page 90.
WARNING: The heat sink and processor are hot to touch for some time after the
system has been powered down. Allow the heat sink and processor to cool before
handling them.
CAUTION: Never remove the heat sink from a processor unless you intend to
remove the processor. The heat sink is necessary to maintain proper thermal
conditions.
5
Using a #2 Phillips screwdriver, loosen one of the heat-sink retention
screws. See Figure 3-26.
6
Wait 30 seconds for the heat sink to loosen from the processor.
7
Loosen the other three heat-sink retention screws.
8
Gently lift the heat sink off of the processor and set the heat sink aside
with thermal grease side facing up.
CAUTION: The processor is held in its socket under strong pressure. Be aware
that the release lever can spring up suddenly if not firmly grasped.
9
Position your thumb firmly over the processor socket-release lever and
release the lever from the locked position. Rotate the lever 90 degrees
upward until the processor is released from the socket. See Figure 3-27.
book.book Page 139 Friday, November 20, 2009 2:56 PM

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Dell PowerEdge R510 Specifications

General IconGeneral
HDD size3.5 \
Hot-swapYes
HDD capacity450 GB
HDD interfaceSerial Attached SCSI (SAS)
Total storage capacity900 GB
Number of HDDs installed2
Number of HDDs supported8
Internal memory4 GB
Memory clock speed1066 MHz
Internal memory typeDDR3-SDRAM
Maximum internal memory64 GB
Tcase76 °C
Bus typeQPI
SteppingD0
FSB ParityNo
Processor codeSLBF6
Processor cache8 MB
Processor cores4
Processor modelE5540
System bus rate5.86 GT/s
Processor seriesIntel Xeon 5500 Series
Processor socketSocket B (LGA 1366)
Processor codenameNehalem EP
Motherboard chipsetIntel® 5500
Processing Die size263 mm²
Processor frequency2.53 GHz
Processor cache typeSmart Cache
Processor lithography45 nm
Processor system typeDP
Processor manufacturerIntel
Processor package size42.5 x 45 mm
Processor front side bus- MHz
Processor boost frequency2.8 GHz
Processor operating modes64-bit
Thermal Design Power (TDP)80 W
CPU multiplier (bus/core ratio)19
Number of Processing Die Transistors731 M
Memory channels supported by processorTriple
Memory clock speeds supported by processor800, 1066 MHz
Memory bandwidth supported by processor (max)25.6 GB/s
Maximum internal memory supported by processor144 GB
PS/2 ports quantity0
Serial ports quantity1
USB 2.0 ports quantity6
DisplayLCD
L1 cache0.064 MB
Form factor-
Graphics cardG200eW
Dimensions (WxDxH)86.4 x 436.6 x 609.6 mm
Compatible operating systemsMicrosoft Windows Small Business Server 2008/2003/ Novell SUSE Linux Enterprise Server 11/10 SP2 Linux Red Hat Enterprise 5.3/4.7 VMware vSphere Version 4.0 VMware ESX v3.5 / ESXi v3.5
Power consumption (typical)1100 W
Noise level42 dB
Chassis typeRack (2U)
PCI Express x4 slots3
Processor ARK ID37104
Intel® Turbo Boost Technology1.0
Weight and Dimensions IconWeight and Dimensions
Weight13500 g

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