Table 1-1 Product components and their descriptions (continued)
Category Description
Primary storage M.2 2280 solid-state drives, PCIe, NVMe
2 TB, three layer cell (TLC)
1 TB, TLC
512 GB, TLC
512 GB, TLC, self-encrypting drive (SED), OPAL2
512 GB, value
256 GB, TLC
256 GB, TLC, SED, OPAL2
Audio andvideo Bang & Olufsen
Quad stereo speakers
Integrated dual top-edge microphones
Discrete ampliers
Camera, IR (infrared), 8 MP, 100° ultrawide viewing angle, HP Camera Privacy Key
Wireless Wireless Local Area Network (WLAN) (onboard, not removable)
Intel AX211 Wi-Fi® 6E Bluetooth® 5.2 WLAN
Intel AX211 Wi-Fi 6E Bluetooth 5.2 vPro WLAN
- Miracast® support
- Support for HP LAN-Wireless Protection (WLAN/LAN/WWAN switching)
- Support for HP Connection Optimizer
- Support for HP Extended Range Wireless LAN
- Supports UEFI Wi-Fi
- Supports Indonesia New Band
- Supports Time Average Power for WLAN
- Supports Dynamic Antenna gain (EU only)
- Supports InTile
- Supports BT Audio Ooad for A2DP
Wireless Wide Area Network (WWAN) (select products only)
Intel 5000 5G Solution WWAN
- eSIM on module
- M.2 30 × 52 socket PCIe
Intel XMM 7560 R + LTE-Advanced Pro WWAN (Cat 16)
- eSIM on module
- Supports Global Series
- M.2 30 × 42 socket PCIe
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