HP ProLiant DL320e User Manual

Operations 19
IMPORTANT: The requirement of extending or removing the server from the rack when
performing installation and maintenance procedures depends on the rail system used:
• If using a ball-bearing rail system, you can perform most installations and maintenance by
simply extending the server from the rack.
• If using a friction rail system, to perform installations or maintenance that requires access panel
removal, remove the server from the rack.
To remove the server from an HP, Compaq-branded, Telco, or third-party rack:
1. Power down the server (on page 17).
2. Disconnect all peripheral cables and power cords from the server rear panel.
3. Extend the server from the rack (on page 17).
4. Remove the server from the rack. For more information, see the documentation that ships with the rack
mounting option.
5. Place the server on a sturdy, level surface.
Remove the security bezel (optional)
To access the front panel components, unlock and then remove the security bezel.
Remove the access panel
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION: Do not operate the server for long periods with the access panel open or removed.
Operating the server in this manner results in improper airflow and improper cooling that can
lead to thermal damage.
1. Power down the server (on page 17).
2. Remove all power:

HP ProLiant DL320e Specifications

General

Bus type	DMI
Stepping	E1
FSB Parity	No
Processor code	SR0PH
Processor cache	8 MB
Processor cores	4
Processor model	E3-1220V2
System bus rate	5 GT/s
Processor series	Intel Xeon E3-1200 v2
Processor socket	LGA 1155 (Socket H2)
Processor codename	Ivy Bridge
Motherboard chipset	Intel® C204
Processor frequency	3.1 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	- MHz
Processor boost frequency	3.5 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	1x16+1x4, 1x8+3x4, 2x8+1x4
Supported instruction sets	AVX, SSE4.1, SSE4.2
Thermal Design Power (TDP)	69 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	31
Memory types supported by processor	DDR3-SDRAM
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	1333, 1600 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	32 GB
HDD size	- \
HDD interface	-
Total storage capacity	0 GB
Maximum storage capacity	12 TB
Number of HDDs installed	0
Memory slots	4x DIMM
Internal memory	4 GB
Memory clock speed	1600 MHz
Graphics card	G200
Graphics card family	Matrox
Cabling technology	10/100/1000Base-T(X)
Networking features	Gigabit Ethernet
USB 2.0 ports quantity	6
Ethernet LAN (RJ-45) ports	2
PCI Express slots version	3.0
Power supply	350 W
Power requirements	100 - 240 V
Power supply input frequency	50 - 60 Hz
Operating altitude	0 - 3048 m
Non-operating altitude	0 - 9144 m
Storage temperature (T-T)	-30 - 60 °C
Operating temperature (T-T)	10 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %
Sustainability certificates	ENERGY STAR
Chassis type	Rack (1U)
Processor ARK ID	65734
Intel TSX-NI version	0.00
Intel Identity Protection Technology version	1.00
On-board graphics card model	Not available

Weight and Dimensions

Depth	750 mm
Width	434.6 mm
Height	43.2 mm