HP ProLiant DL320e User Manual

Hardware options installation 45
IMPORTANT: This server does not support mixing LRDIMMs, RDIMMs, or UDIMMs. Attempting
to mix any combination of these DIMMs can cause the server to halt during BIOS initialization.
The server memory subsystem supports UDIMMs only. UDIMMs represent the most basic type of memory
module and offer lower latency and (relatively) low power consumption, but are limited in capacity.
The server supports dual-rank, PC3-10600E/PC3-12800E (DDR3 ECC) DIMMs operating at 1333 or 1600
MHz speed.
Depending on the processor model and the number of DIMMs installed, the memory clock speed might be
reduced to 1333 or 1066 MHz. For more information, see "General DIMM slot population guidelines (on
page 46)."
HP SmartMemory
HP SmartMemory, introduced for Gen8 servers, authenticates and unlocks certain features available only on
HP Qualified memory and verifies whether installed memory has passed HP qualification and test processes.
Qualified memory is performance-tuned for HP ProLiant and BladeSystem servers and provides future
enhanced support through HP Active Health and manageability software.
Certain performance features are unique with HP SmartMemory. The industry supports UDIMM at 2 DIMMs
per channel at 1066 MT/s. HP SmartMemory supports 2 DIMMs per channel at 1333 MT/s, or 25% greater
bandwidth.
DIMM identification
To determine DIMM characteristics, use the label attached to the DIMM and the following illustration and
table.
Item Description Definition
1
Size —
2
Rank 1R = Single-rank
2R = Dual-rank
3R = Three-rank
4R = Quad-rank

HP ProLiant DL320e Specifications

General

Bus type	DMI
Stepping	E1
FSB Parity	No
Processor code	SR0PH
Processor cache	8 MB
Processor cores	4
Processor model	E3-1220V2
System bus rate	5 GT/s
Processor series	Intel Xeon E3-1200 v2
Processor socket	LGA 1155 (Socket H2)
Processor codename	Ivy Bridge
Motherboard chipset	Intel® C204
Processor frequency	3.1 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	- MHz
Processor boost frequency	3.5 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	1x16+1x4, 1x8+3x4, 2x8+1x4
Supported instruction sets	AVX, SSE4.1, SSE4.2
Thermal Design Power (TDP)	69 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	31
Memory types supported by processor	DDR3-SDRAM
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	1333, 1600 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	32 GB
HDD size	- \
HDD interface	-
Total storage capacity	0 GB
Maximum storage capacity	12 TB
Number of HDDs installed	0
Memory slots	4x DIMM
Internal memory	4 GB
Memory clock speed	1600 MHz
Graphics card	G200
Graphics card family	Matrox
Cabling technology	10/100/1000Base-T(X)
Networking features	Gigabit Ethernet
USB 2.0 ports quantity	6
Ethernet LAN (RJ-45) ports	2
PCI Express slots version	3.0
Power supply	350 W
Power requirements	100 - 240 V
Power supply input frequency	50 - 60 Hz
Operating altitude	0 - 3048 m
Non-operating altitude	0 - 9144 m
Storage temperature (T-T)	-30 - 60 °C
Operating temperature (T-T)	10 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %
Sustainability certificates	ENERGY STAR
Chassis type	Rack (1U)
Processor ARK ID	65734
Intel TSX-NI version	0.00
Intel Identity Protection Technology version	1.00
On-board graphics card model	Not available

Weight and Dimensions

Depth	750 mm
Width	434.6 mm
Height	43.2 mm