HP ProLiant DL320e User Manual

Setup 25
Space and airflow requirements
To allow for servicing and adequate airflow, observe the following space and airflow requirements when
deciding where to install a rack:
• Leave a minimum clearance of 63.5 cm (25 inches) in front of the rack.
• Leave a minimum clearance of 76.2 cm (30 inches) behind the rack.
• Leave a minimum clearance of 121.9 cm (48 inches) from the back of the rack to the back of another
rack or row of racks.
HP servers draw in cool air through the front and expel warm air through the rear. Therefore, the front and
rear rack doors must be adequately ventilated to allow ambient room air to enter the cabinet, and the rear
door must be adequately ventilated to allow the warm air to escape from the cabinet.
CAUTION: To prevent improper cooling and damage to the equipment, do not block the
ventilation openings.
When vertical space in the rack is not filled by a server or rack component, the gaps between the
components might cause changes in airflow through the rack and across the servers. To maintain airflow
cover all gaps with blanking panels.
CAUTION: Always use blanking panels to fill empty vertical spaces in the rack. This arrangement
ensures proper airflow. Using a rack without blanking panels results in improper cooling that can
lead to thermal damage.
The 9000 and 10000 series racks provide proper server cooling from flow-through perforations in the front
and rear doors that provide 64% open area for ventilation.
CAUTION: When using a Compaq branded 7000 series rack, install the high airflow rack door
insert (PN 327281-B21 for 42U rack, PN 157847-B21 for 22U rack) to provide proper
front-to-back airflow and cooling.
CAUTION: If a third-
party rack is used, observe the following additional requirements to ensure
adequate airflow and to prevent damage to the equipment:
• Front and rear doors—If the 42U rack includes closing front and rear doors, you must allow
5,350 sq cm (830 sq in) of holes evenly distributed from top to bottom to permit adequate
airflow (equivalent to the required 64 percent open area for ventilation).
• Side—The clearance between the installed rack component and the side panels of the rack
must be a minimum of 7 cm (2.75 in).
Temperature requirements
To ensure continued safe and reliable equipment operation, install or position the system in a well-ventilated,
climate-controlled environment.
The maximum recommended ambient operating temperature (TMRA) for most server products is 35°C
(95°F). The temperature in the room where the rack is located must not exceed 35°C (95°F).
CAUTION: To reduce the risk of damage to the equipment when installing third-party options:
• Do not permit optional equipment to impede airflow around the server or to increase the
internal rack temperature beyond the maximum allowable limits.
• Do not exceed the manufacturer’s TMRA.

HP ProLiant DL320e Specifications

General

Bus type	DMI
Stepping	E1
FSB Parity	No
Processor code	SR0PH
Processor cache	8 MB
Processor cores	4
Processor model	E3-1220V2
System bus rate	5 GT/s
Processor series	Intel Xeon E3-1200 v2
Processor socket	LGA 1155 (Socket H2)
Processor codename	Ivy Bridge
Motherboard chipset	Intel® C204
Processor frequency	3.1 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	- MHz
Processor boost frequency	3.5 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	1x16+1x4, 1x8+3x4, 2x8+1x4
Supported instruction sets	AVX, SSE4.1, SSE4.2
Thermal Design Power (TDP)	69 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	31
Memory types supported by processor	DDR3-SDRAM
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	1333, 1600 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	32 GB
HDD size	- \
HDD interface	-
Total storage capacity	0 GB
Maximum storage capacity	12 TB
Number of HDDs installed	0
Memory slots	4x DIMM
Internal memory	4 GB
Memory clock speed	1600 MHz
Graphics card	G200
Graphics card family	Matrox
Cabling technology	10/100/1000Base-T(X)
Networking features	Gigabit Ethernet
USB 2.0 ports quantity	6
Ethernet LAN (RJ-45) ports	2
PCI Express slots version	3.0
Power supply	350 W
Power requirements	100 - 240 V
Power supply input frequency	50 - 60 Hz
Operating altitude	0 - 3048 m
Non-operating altitude	0 - 9144 m
Storage temperature (T-T)	-30 - 60 °C
Operating temperature (T-T)	10 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %
Sustainability certificates	ENERGY STAR
Chassis type	Rack (1U)
Processor ARK ID	65734
Intel TSX-NI version	0.00
Intel Identity Protection Technology version	1.00
On-board graphics card model	Not available

Weight and Dimensions

Depth	750 mm
Width	434.6 mm
Height	43.2 mm