HP ProLiant ML10 v2 User Manual

Hardware options installation 35
General DIMM slot population guidelines
• The server has four DIMM slots.
• The server supports two channels with two DIMM slots per channel.
o Memory channel 1 consists of the two DIMMs that are closest to the processor.
o Memory channel 2 consists of the two DIMMs that are farthest from the processor.
• A white DIMM slot indicates the first slot of a channel (2-A, 4-B).
• Memory speed support depends on the type of processor installed. For more information, see the
technical specification of the installed processor.
• The server supports up to 1600 MT/s ECC UDIMMs.
• The server supports up to 32 GB (4x8 GB) UDIMMs.
• The server does not support:
o RDIMMs
o Non-ECC UDIMMs
• When installing DIMMs:
o Populate the DIMM slots in this sequence: 2-A, 4-B, 1-C, 3-D.
o Use HP-qualified UDIMMs.
Installing a DIMM
1. Power down the server (on page 13).
2. Remove all power:
a. Disconnect each power cord from the power source.
b. Disconnect each power cord from the server.
3. Do the following:
a. Unlock the tower bezel (on page 14).
b. Remove the tower bezel (on page 14).
4. Remove the access panel (on page 15).
5. Remove the air baffle (on page 17).
6. Open the DIMM slot latches.

HP ProLiant ML10 v2 Specifications

General

Bus type	DMI
Stepping	C0
FSB Parity	No
Scalability	1S
Processor cache	8 MB
Processor cores	4
Processor model	E3-1220V3
System bus rate	5 GT/s
Processor series	Intel Xeon E3-1200 v3
Processor socket	LGA 1150 (Socket H3)
Processor codename	Haswell
Motherboard chipset	Intel® C222
Processor frequency	3.1 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	- MHz
Processor boost frequency	3.5 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	1x8, 1x16, 2x4, 2x8
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Thermal Design Power (TDP)	80 W
Compatible processor series	Intel® Xeon®
Number of processors installed	1
Thermal solution specification	PCG 2013D
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3-SDRAM
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	1333, 1600 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	32 GB
HDD size	3.5 \
HDD interface	-
SSD interface	Serial Attached SCSI (SAS)
Total storage capacity	1000 GB
Maximum storage capacity	24 TB
Memory slots	4x DIMM
Internal memory	8 GB
Memory clock speed	1600 MHz
Graphics card	G200
DVD interface type	SATA
Graphics card family	Matrox
Intel® Virtualization Technology (Intel® VT)	VT-d, VT-x
Cabling technology	10/100/1000Base-T(X)
Ethernet interface type	Gigabit Ethernet
Serial ports quantity	0
USB 2.0 ports quantity	2
PCI Express slots version	3.0
Performance management	HP iLO
Compatible operating systems	Microsoft Windows Server\\r Canonical Ubuntu\\r Red Hat Enterprise Linux (RHEL)\\r SUSE Linux Enterprise Server (SLES)\\r VMware
Processor ARK ID	75052
Intel Identity Protection Technology version	1.00
Chassis type	Tower (4U)
Power supply	350 W
Operating altitude	0 - 3048 m
Non-operating altitude	0 - 9144 m
Storage temperature (T-T)	-30 - 65 °C
Operating temperature (T-T)	0 - 40 °C
Storage relative humidity (H-H)	0 - 95 %
Operating relative humidity (H-H)	10 - 90 %
On-board graphics card model	Not available

Weight and Dimensions

Depth	475.2 mm
Width	175 mm
Height	368.2 mm