HP ProLiant ML10 v2 User Manual

Hardware options installation 37
3. Connect the cable to any switch network port.
Completing the switch Self-Test
1. Connect the power adapter to the switch.
2. Connect the power adapter to the AC power source.
3. Check the status of the switch Power LED. This LED is solid green to indicate that the power connection
is established.
4. Check the status of the following switch LEDs:
o Link/Act LED on the switch network port that is being used—Initially, solid green to indicate
successful connection, and then flashing green to indicate active communication with the network.
o Fault LED—Remains off to indicate successful Self-Test completion.
For more information on the location of the switch LEDs and their behavior during the Self-Test process,
see the switch documentation.
Completing the switch setup
After the Ethernet cable connection is made, check the network LED status on both the server and the switch
to confirm successful connection:
• In the server front panel, the NIC status LED —Solid green
• In the switch, the Link/Act LED on the network connector used—Initially, solid green to indicate
successful connection, and then flashing green to indicate active communication with the network.
HP Trusted Platform Module option
For more information about product features, specifications, options, configurations, and compatibility, see
the product QuickSpecs on the HP website (http://www.hp.com/go/qs).
Use these instructions to install and enable a TPM on a supported server. This procedure includes three
sections:
1. Installing the Trusted Platform Module board.
2. Retaining the recovery key/password (on page 40).

HP ProLiant ML10 v2 Specifications

General

Bus type	DMI
Stepping	C0
FSB Parity	No
Scalability	1S
Processor cache	8 MB
Processor cores	4
Processor model	E3-1220V3
System bus rate	5 GT/s
Processor series	Intel Xeon E3-1200 v3
Processor socket	LGA 1150 (Socket H3)
Processor codename	Haswell
Motherboard chipset	Intel® C222
Processor frequency	3.1 GHz
Processor cache type	Smart Cache
Processor lithography	22 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	- MHz
Processor boost frequency	3.5 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	1x8, 1x16, 2x4, 2x8
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Thermal Design Power (TDP)	80 W
Compatible processor series	Intel® Xeon®
Number of processors installed	1
Thermal solution specification	PCG 2013D
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3-SDRAM
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	1333, 1600 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	32 GB
HDD size	3.5 \
HDD interface	-
SSD interface	Serial Attached SCSI (SAS)
Total storage capacity	1000 GB
Maximum storage capacity	24 TB
Memory slots	4x DIMM
Internal memory	8 GB
Memory clock speed	1600 MHz
Graphics card	G200
DVD interface type	SATA
Graphics card family	Matrox
Intel® Virtualization Technology (Intel® VT)	VT-d, VT-x
Cabling technology	10/100/1000Base-T(X)
Ethernet interface type	Gigabit Ethernet
Serial ports quantity	0
USB 2.0 ports quantity	2
PCI Express slots version	3.0
Performance management	HP iLO
Compatible operating systems	Microsoft Windows Server\\r Canonical Ubuntu\\r Red Hat Enterprise Linux (RHEL)\\r SUSE Linux Enterprise Server (SLES)\\r VMware
Processor ARK ID	75052
Intel Identity Protection Technology version	1.00
Chassis type	Tower (4U)
Power supply	350 W
Operating altitude	0 - 3048 m
Non-operating altitude	0 - 9144 m
Storage temperature (T-T)	-30 - 65 °C
Operating temperature (T-T)	0 - 40 °C
Storage relative humidity (H-H)	0 - 95 %
Operating relative humidity (H-H)	10 - 90 %
On-board graphics card model	Not available

Weight and Dimensions

Depth	475.2 mm
Width	175 mm
Height	368.2 mm