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HP ProLiant ML10 v2 User Manual

HP ProLiant ML10 v2
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Electrostatic discharge 55
Electrostatic discharge
Preventing electrostatic discharge
To prevent damaging the system, be aware of the precautions you need to follow when setting up the system
or handling parts. A discharge of static electricity from a finger or other conductor may damage system
boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.
To prevent electrostatic damage:
Avoid hand contact by transporting and storing products in static-safe containers.
Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.
Place parts on a grounded surface before removing them from their containers.
Avoid touching pins, leads, or circuitry.
Always be properly grounded when touching a static-sensitive component or assembly.
Grounding methods to prevent electrostatic discharge
Several methods are used for grounding. Use one or more of the following methods when handling or
installing electrostatic-sensitive parts:
Use a wrist strap connected by a ground cord to a grounded workstation or computer chassis. Wrist
straps are flexible straps with a minimum of 1 megohm ±10 percent resistance in the ground cords. To
provide proper ground, wear the strap snug against the skin.
Use heel straps, toe straps, or boot straps at standing workstations. Wear the straps on both feet when
standing on conductive floors or dissipating floor mats.
Use conductive field service tools.
Use a portable field service kit with a folding static-dissipating work mat.
If you do not have any of the suggested equipment for proper grounding, have an authorized reseller install
the part.
For more information on static electricity or assistance with product installation, contact an authorized
reseller.

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HP ProLiant ML10 v2 Specifications

General IconGeneral
Bus typeDMI
SteppingC0
FSB ParityNo
Scalability1S
Processor cache8 MB
Processor cores4
Processor modelE3-1220V3
System bus rate5 GT/s
Processor seriesIntel Xeon E3-1200 v3
Processor socketLGA 1150 (Socket H3)
Processor codenameHaswell
Motherboard chipsetIntel® C222
Processor frequency3.1 GHz
Processor cache typeSmart Cache
Processor lithography22 nm
Processor manufacturerIntel
Processor package size37.5 x 37.5 mm
Processor front side bus- MHz
Processor boost frequency3.5 GHz
Processor operating modes64-bit
ECC supported by processorYes
PCI Express configurations1x8, 1x16, 2x4, 2x8
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Thermal Design Power (TDP)80 W
Compatible processor seriesIntel® Xeon®
Number of processors installed1
Thermal solution specificationPCG 2013D
Maximum number of PCI Express lanes16
Memory types supported by processorDDR3-SDRAM
Memory channels supported by processorDual
Memory clock speeds supported by processor1333, 1600 MHz
Memory bandwidth supported by processor (max)25.6 GB/s
Maximum internal memory supported by processor32 GB
HDD size3.5 \
HDD interface-
SSD interfaceSerial Attached SCSI (SAS)
Total storage capacity1000 GB
Maximum storage capacity24 TB
Memory slots4x DIMM
Internal memory8 GB
Memory clock speed1600 MHz
Graphics cardG200
DVD interface typeSATA
Graphics card familyMatrox
Intel® Virtualization Technology (Intel® VT)VT-d, VT-x
Cabling technology10/100/1000Base-T(X)
Ethernet interface typeGigabit Ethernet
Serial ports quantity0
USB 2.0 ports quantity2
PCI Express slots version3.0
Performance managementHP iLO
Compatible operating systemsMicrosoft Windows Server\\r Canonical Ubuntu\\r Red Hat Enterprise Linux (RHEL)\\r SUSE Linux Enterprise Server (SLES)\\r VMware
Processor ARK ID75052
Intel Identity Protection Technology version1.00
Chassis typeTower (4U)
Power supply350 W
Operating altitude0 - 3048 m
Non-operating altitude0 - 9144 m
Storage temperature (T-T)-30 - 65 °C
Operating temperature (T-T)0 - 40 °C
Storage relative humidity (H-H)0 - 95 %
Operating relative humidity (H-H)10 - 90 %
On-board graphics card modelNot available
Weight and Dimensions IconWeight and Dimensions
Depth475.2 mm
Width175 mm
Height368.2 mm

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