HP Spectre 13 User Manual

Grounding guidelines
Electrostatic discharge damage
Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure determine
the degree of sensitivity. Networks built into many integrated circuits provide some protection, but in many
cases, ESD contains enough power to alter device parameters or melt silicon junctions.
A discharge of static electricity from a nger or other conductor can destroy static-sensitive devices or
microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.
An electronic device exposed to ESD may not be aected at all and can work perfectly throughout a normal
cycle. Or the device may function normally for a while, then degrade in the internal layers, reducing its
life expectancy.
CAUTION: To prevent damage to the computer when you are removing or installing internal components,
observe these precautions:
Keep components in their electrostatic-safe containers until you are ready to install them.
Before touching an electronic component, discharge static electricity by using the guidelines described in
this section.
Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
The following table shows how humidity aects the electrostatic voltage levels generated by dierent activities.
CAUTION: A product can be degraded by as little as 700 V.
Typical electrostatic voltage levels
Relative humidity
Event 10% 40% 55%
Walking across carpet 35,000 V 15,000 V 7,500 V
Walking across vinyl oor 12,000 V 5,000 V 3,000 V
Motions of bench worker 6,000 V 800 V 400 V
Removing DIPS from plastic tube 2,000 V 700 V 400 V
Removing DIPS from vinyl tray 11,500 V 4,000 V 2,000 V
Removing DIPS from Styrofoam 14,500 V 5,000 V 3,500 V
Removing bubble pack from PCB 26,500 V 20,000 V 7,000 V
Packing PCBs in foam-lined box 21,000 V 11,000 V 5,000 V
26 Chapter 4 Removal and replacement preliminary requirements

HP Spectre 13 Specifications

General

Form factor	Clamshell
Product type	Laptop
Product color	Silver
Housing material	Aluminium, Carbon fibre
Country of origin	China
Memory slots	1x SO-DIMM
Internal memory	8 GB
Memory clock speed	1866 MHz
Memory form factor	On-board
Internal memory type	LPDDR3-SDRAM
Memory layout (slots x size)	1 x 8 GB
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
SSD interface	PCI Express
Storage media	SSD
SSD form factor	M.2
Card reader integrated	No
Total storage capacity	1024 GB
Compatible memory cards	SD, SDHC, SDXC
Number of SSDs installed	1
LED backlight	Yes
Display surface	Gloss
Display diagonal	13.3 \
Native aspect ratio	16:9
On-board graphics card ID	0x5916
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 620
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	32 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	300 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1050 MHz
Speakers manufacturer	Bang & Olufsen
Number of built-in speakers	2
WWAN	Not installed
Wi-Fi standards	Wi-Fi 5 (802.11ac)
Bluetooth version	4.2
Charging port type	DC-in jack
USB 2.0 ports quantity	0
USB Sleep-and-Charge ports	3
Cable lock slot type	Kensington
AC adapter power	45 W
AC adapter frequency	50 - 60 Hz
AC adapter input voltage	100 - 240 V
AC adapter output voltage	19 V
Battery capacity	38 Wh
Battery life (max)	8 h
Number of battery cells	4
Pointing device	Touchpad
Bus type	OPI
Stepping	H0
Tjunction	100 °C
Processor cache	4 MB
Processor model	i7-7500U
System bus rate	4 GT/s
Processor family	Intel® Core™ i7
Processor socket	BGA 1356
Processor codename	Kaby Lake
Configurable TDP-up	25 W
Processor frequency	2.7 GHz
Processor cache type	Smart Cache
Configurable TDP-down	7.5 W
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	3.5 GHz
Processor operating modes	64-bit
PCI Express configurations	1x2+2x1, 1x4, 2x2, 4x1
Thermal Design Power (TDP)	15 W
Configurable TDP-up frequency	2.9 GHz
Configurable TDP-down frequency	0.8 GHz
Maximum number of PCI Express lanes	12
Sustainability certificates	RoHS, EPEAT Silver, ENERGY STAR
Processor code	SR2ZV
Processor ARK ID	95451
Processor package size	42 x 24 mm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Intel Identity Protection Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00

Weight and Dimensions

Depth	229 mm
Width	325 mm
Height	10.4 mm
Weight	1110 g