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HP Spectre 13 User Manual

HP Spectre 13
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NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and the system
board components each time the heat sink is removed. Replacement thermal material is included with the heat
sink and system board spare part kits.
Thermal paste is used on the processor (1) and the heat sink section (2) that services it.
Reverse this procedure to install the heat sink.
Keyboard
NOTE: All keyboard spare part kits include the backlight cover, backlight cable, and keyboard cable.
For use in country/region Spare part number For use in country/region Spare part number
In ceramic white nish: For use in Russia L04544-251
For use in Canada L04544-DB1 For use in Saudi Arabia L04544-171
For use in the Czech Republic
and Slovakia
L04544-FL1 For use in South Korea L04544-AD1
For use in Denmark, Finland,
and Norway
L04544-DH1 For use in Spain L04544-071
For use in France L04544-051 For use in Switzerland L04544-BG1
For use in Germany L04544-041 For use in Taiwan L04544-AB1
For use in Japan L04544-291 For use in Thailand L04544-281
For use in Latin America L04544-161 For use in Turkey L04544-141
For use in the Netherlands L04544-B31 For use in the United Kingdom L04544-031
For use in Portugal L04544-131 For use in the United States L04544-001
In dark ash silver nish: For use in Russia L04543-251
For use in Canada L04543-DB1 For use in Saudi Arabia L04543-171
For use in the Czech Republic
and Slovakia
L04543-FL1 For use in South Korea L04543-AD1
For use in Denmark, Finland,
and Norway
L04543-DH1 For use in Spain L04543-071
For use in France L04543-051 For use in Switzerland L04543-BG1
For use in Germany L04543-041 For use in Taiwan L04543-AB1
For use in Japan L04543-291 For use in Thailand L04543-281
Component replacement procedures 45

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HP Spectre 13 Specifications

General IconGeneral
Form factorClamshell
Product typeLaptop
Product colorSilver
Housing materialAluminium, Carbon fibre
Country of originChina
Memory slots1x SO-DIMM
Internal memory8 GB
Memory clock speed1866 MHz
Memory form factorOn-board
Internal memory typeLPDDR3-SDRAM
Memory layout (slots x size)1 x 8 GB
SSD capacityThe Solid State Drive's storage capacity in Gigabytes.
SSD interfacePCI Express
Storage mediaSSD
SSD form factorM.2
Card reader integratedNo
Total storage capacity1024 GB
Compatible memory cardsSD, SDHC, SDXC
Number of SSDs installed1
LED backlightYes
Display surfaceGloss
Display diagonal13.3 \
Native aspect ratio16:9
On-board graphics card ID0x5916
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 620
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory32 GB
On-board graphics card OpenGL version4.4
On-board graphics card base frequency300 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1050 MHz
Speakers manufacturerBang & Olufsen
Number of built-in speakers2
WWANNot installed
Wi-Fi standardsWi-Fi 5 (802.11ac)
Bluetooth version4.2
Charging port typeDC-in jack
USB 2.0 ports quantity0
USB Sleep-and-Charge ports3
Cable lock slot typeKensington
AC adapter power45 W
AC adapter frequency50 - 60 Hz
AC adapter input voltage100 - 240 V
AC adapter output voltage19 V
Battery capacity38 Wh
Battery life (max)8 h
Number of battery cells4
Pointing deviceTouchpad
Bus typeOPI
SteppingH0
Tjunction100 °C
Processor cache4 MB
Processor modeli7-7500U
System bus rate4 GT/s
Processor familyIntel® Core™ i7
Processor socketBGA 1356
Processor codenameKaby Lake
Configurable TDP-up25 W
Processor frequency2.7 GHz
Processor cache typeSmart Cache
Configurable TDP-down7.5 W
Processor lithography14 nm
Processor manufacturerIntel
PCI Express slots version3.0
Processor boost frequency3.5 GHz
Processor operating modes64-bit
PCI Express configurations1x2+2x1, 1x4, 2x2, 4x1
Thermal Design Power (TDP)15 W
Configurable TDP-up frequency2.9 GHz
Configurable TDP-down frequency0.8 GHz
Maximum number of PCI Express lanes12
Sustainability certificatesRoHS, EPEAT Silver, ENERGY STAR
Processor codeSR2ZV
Processor ARK ID95451
Processor package size42 x 24 mm
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Intel Identity Protection Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Weight and Dimensions IconWeight and Dimensions
Depth229 mm
Width325 mm
Height10.4 mm
Weight1110 g

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