1.3 Heat Dissipation System
The heat dissipation system is responsible for the heat dissipation of the entire device. Heat
generated by the boards is dissipated through the heat dissipation system. In this manner, the
temperatures of the components on the boards are controlled within a normal range, enabling
the boards to work stably. The heat dissipation system is composed of a fan frame, an air intake
vent, an air exhaust vent, and an air channel. All the fans in the fan frame work simultaneously,
and their rotation speeds can be adjusted by area. When one fan fails, the heat dissipation system
can still allow the device to work at the ambient temperature of 40°C ( 104°F ) for a short period.
The temperature sensors, which are located on the air exhaust vent and boards, monitor the
temperatures of the components on the boards and adjust the fan rotation speeds according to
the commands delivered by the MPU to control the board temperatures.
1.3.1 System Air Channel
The NE40E-X1 dissipates heat by blowing air in a left-to-right direction. Figure 1-8 shows the
air flow in the NE40E-X1.
Figure 1-8 Air flow in the NE40E-X1
1.3.2 Fan Module
The air intake vent of the NE40E-X1 is 3 U ( 133.35 mm or 5.25 in. ) high and 220 mm ( 8.67
in. ) deep.
There are six fans in the fan frame of the NE40E-X1. When one fan fails, the device can still
work at the ambient temperature of 40°C ( 104°F ) for a short period.
The rotation speeds of the fans can be adjusted based on the device temperature automatically .
HUAWEI NE40E-X1 & NE40E-X2 Universal Service
Router
Hardware Description 1 NE40E-X1 Hardware Description
Issue 02 (2011-09-10) Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
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