26 Mobile Intel
®
945GM Express Chipset
Development Kit User’s Manual
Theory of Operation
3.2 Mechanical Form Factor
The evaluation board conforms to the ATX form factor. For extra protection in a development
environment, you may want to install the evaluation board in an ATX chassis. Internal and rear
panel system I/O connectors are described in Section 3.4.3. An overview of connector and slot
locations is provided in Section 4.
3.3 Thermal Management
The objective of thermal management is to ensure that the temperature of each component is
maintained within specified functional limits. The functional temperature limit is the range within
which the electrical circuits can be expected to meet their specified performance requirements.
Operation outside the functional limit can degrade system performance and cause reliability
problems.
The development kit is shipped with a fansink thermal solution for installation on the processor.
This thermal solution has been tested in an open-air environment at room temperature and is
sufficient for evaluation purposes. The designer must ensure that adequate thermal management is
provided for any customer-derived designs.
3.4 System Features and Operation
The following sections provide a detailed view of system features and operation. Refer to Figure 2
and Table 7 for the location of the major components of the platform.
The Intel
®
945GM Express Chipset features the 82945GM Graphics Memory Controller Hub and
the Intel
®
I/O Controller Hub (ICH7-M).
3.4.1 Intel(R) 945GM GMCH
The Intel
®
945GM Express Chipset GMCH provides the processor interface optimized for Intel
®
Core
TM
Duo Processors, system memory interface, DMI and internal graphics. It provides
flexibility and scalability in graphics and memory subsystem performance. The following list
describes the reference board’s implementation of the Intel
®
945GM Express Chipset GMCH
features.
A list of features follows:
• 1466 Micro-FCBGA package
• 533/667 MHz Front Side Bus
• 32-bit host bus addressing
• System memory controller (DDR2 implemented)
— Supports Dual Channel and Single Channel operation
— Two 200-pin SODIMM slots
— DDR2 400/533/667
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