Technical Reference
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Table 53 provides maximum case temperatures for D850GB board components that are sensitive
to thermal changes. Case temperatures could be affected by the operating temperature, current
load, or operating frequency. Maximum case temperatures are important when considering proper
airflow to cool the D850GB board.
Table 53. Thermal Considerations for Components
Component Maximum Case Temperature
Intel Pentium 4 processor For processor case temperature, see processor
datasheets and processor specification updates
Intel
82850 MCH 105
o
C (under bias)
Intel 82801BA ICH2 109
o
C (under bias)
For information about Refer to
Intel Pentium 4 processor datasheets and specification updates Section 1.2, page 16
2.13 Reliability
The mean time between failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability Prediction
Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF prediction is used to estimate
repair rates and spare parts requirements.
The Mean Time Between Failures (MTBF) data is calculated from predicted data at 55 ºC.
D850GB board MTBF: 104769.75 hours