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Mitsubishi MELSEC QCPU User Manual

Mitsubishi MELSEC QCPU
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MELSEC-Q/QnA
6 BASIC INSTRUCTIONS
High Performance
QnA Q4AR
Basic
QCPU
PLC CPU
Process CPU
6.2.14 Incrementing and decrementing 32-bit BIN data
(DINC, DINCP, DDEC, DDECP)
Usable Devices
Internal Devices
(System, User)
MELSECNET/10(H)
Direct J
\
Set
Data
Bit Word
File
Register
Bit Word
Special
Function
Module
U
\G
Index
Register
Zn
Constant
K, H
Other
D
[Instruction Symbol] [Execution Condition]
indicates DINC/DDEC
Command
Command
P
D
DINC, DDEC
DINCP, DDECP
D
[Set Data]
Set Data Meaning Data Type
D
Head number of device what will execute the DINC (+1) or DDEC (-1)
operation
BIN 32 bits
[Functions]
DINC
(1) Adds 1 to the device designated by
D
(32-bit data).
+1
73500 (BIN)
73501 (BIN)
+1
D D
+1
D D
b31- -b16
b15- -b0
b31- -b16
b15- -b0
(2) If the contents of the device designated by
D
are 2147483647, and the DINC or DINCP
instruction is executed, the value -2147483648 will be stored at the device designated by
D
.
DDEC
(1) Subtracts 1 from the device designated by
D
(32-bit data).
+1
73500 (BIN)
73499 (BIN)
-1
D D
+1
D D
b31- -b16
b15- -b0
b31- -b16
b15- -b0
(2) If the contents of the device designated by
D
are 0, and the DINC or DINCP instruction is
executed, the value -1 will be stored at the device designated by
D
.
[Operation Errors]
(1) There are no operation errors associated with DINC(P) or DDEC(P).
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Table of Contents

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Mitsubishi MELSEC QCPU Specifications

General IconGeneral
ModelMELSEC QCPU
SeriesQ Series
CategoryController
MemoryVaries depending on CPU type
Program MemoryVaries depending on CPU type (e.g., 32K steps to 260K steps or more)
Data MemoryVaries depending on CPU type (e.g., 64K words to 512K words)
I/O CapacityUp to 4096 points (varies by model)
Number of I/O PointsUp to 4096 points
CommunicationEthernet
Programming LanguageLadder Logic, Instruction List, SFC, ST, Function Block Diagram
Program CapacityVaries depending on CPU type (e.g., 32K steps to 260K steps or more)
Power Supply24V DC or 100-240V AC (depending on model)
Operating Temperature0°C to 55°C
Storage Temperature-25°C to 75°C
Humidity5 to 95% RH, non-condensing
Shock Resistance147 m/s2, 3 times in X, Y, and Z directions

Summary

SAFETY PRECAUTIONS

REVISIONS

GENERAL DESCRIPTION

Related Programming Manuals

Lists other relevant programming manuals.

Abbreviation and Generic Name

Explains abbreviations and generic names used.

INSTRUCTION TABLES

Types of Instructions

Categorizes the types of CPU module instructions.

How to Read Instruction Tables

Explains the format and conventions of instruction tables.

Sequence Instructions

Instructions for relay control ladders.

Basic Instructions

Common operations like comparison and arithmetic.

Application Instructions

Instructions for specific applications like logical operations.

Instructions for Data Link

Instructions for data communication between stations.

QCPU Instructions

Instructions specific to QCPU modules.

Redundant System Instructions (For Q4ARCPU)

Instructions for redundant system configuration.

CONFIGURATION OF INSTRUCTIONS

Configuration of Instructions

Explains the structure of CPU module instructions.

Designating Data

Describes how to designate data types for instructions.

Index Modification

Explains how to use index registers for indirect addressing.

Indirect Designation

Explains how to use indirect addressing for devices.

Subset Processing

Explains subset processing for performance improvement.

Cautions on Programming (Operation Errors)

Describes programming cautions and potential operation errors.

Conditions for Execution of Instructions

Explains different execution conditions for instructions.

Counting Step Number

Explains how step numbers are calculated for instructions.

Operation when OUT, SET/RST, or PLS/PLF Instructions Use the Same Device

Explains behavior when multiple instructions use the same device.

HOW TO READ INSTRUCTIONS

How to Read Instructions

Explains how to read instruction descriptions.

SEQUENCE INSTRUCTIONS

Contact Instructions

Instructions for operation start and connections.

Connection Instructions

Instructions for connecting ladder blocks.

Operation results push, read, pop (MPS, MRD, MPP)

Instructions for managing operation results.

Timers (OUT T, OUTH T)

Instructions for low and high speed timers.

Counters (OUT C)

Instructions for up/down counters.

Resetting devices (except for annunciators) (RST)

Instruction to reset devices OFF.

Leading edge and trailing edge output (PLS, PLF)

Instructions for pulse output on leading/trailing edges.

Shift Instruction

Instructions for shifting bit devices.

Master Control Instructions

Instructions for master control of program execution.

Termination Instructions

Instructions to terminate program execution.

Other Instructions

Miscellaneous instructions.

BASIC INSTRUCTIONS

Comparison Operation Instruction

Instructions for comparing data.

Arithmetic Operation Instructions

Instructions for addition, subtraction, multiplication, division.

Data Conversion Instructions

Instructions for converting data formats.

Data Transfer Instructions

Instructions for moving data.

Program Execution Control Instructions

Instructions to control program execution flow.

Other Convenient Instructions

Various useful instructions.

APPENDICES

APPENDIX1 OPERATION PROCESSING TIME

Details processing times for various CPU modules.

APPENDIX 2 COMPARISON OF PERFORMANCE BETWEEN CPUs

Compares performance across different CPU types.

APPENDIX 3 SPECIAL RELAY LIST

Lists and explains special relays.

APPENDIX 4 SPECIAL REGISTER LIST

Lists and explains special registers.

APPENDIX 5 APPLICATION PROGRAM EXAMPLES

Provides examples of application programs.

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