LTE Standard Module Series
EC200U_Series_Hardware_Design 89 / 94
Table 53: Recommended Thermal Profile Parameters
7.3. Packaging Specifications
The module adopts carrier tape packaging and details are as follow:
1. During manufacturing and soldering, or any other processes that may contact the module directly,
NEVER wipe the module’s shielding can with organic solvents, such as acetone, ethyl alcohol,
isopropyl alcohol, trichloroethylene, etc. Otherwise, the shielding can may become rusted.
2. The shielding can for the module is made of Cupro-Nickel base material. It is tested that after 12
hours’ Neutral Salt Spray test, the laser engraved label information on the shielding can is still
clearly identifiable and the QR code is still readable, although white rust may be found.
3. If a conformal coating is necessary for the module, do NOT use any coating material that may
chemically react with the PCB or shielding cover, and prevent the coating material from flowing into
the module.
4. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance
for any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic
soldering) that is not mentioned in document [4].
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