ZED-F9P-Integration Manual
UBX-18010802 - R01
Contents Page 4 of 64
Objective Specification - Confidential
3.1 ESD handling precautions.................................................................................................................. 34
3.2 ESD protection measures...................................................................................................................34
3.3 EOS precautions................................................................................................................................... 35
3.4 Safety precautions............................................................................................................................... 35
4 Electromagnetic interference on I/O lines..................................................................36
4.1 General notes on interference issues.............................................................................................. 36
4.2 In-band interference mitigation........................................................................................................ 37
4.3 Out-of-band interference....................................................................................................................37
5 Design..................................................................................................................................... 39
5.1 Pin assigment........................................................................................................................................39
5.2 RF front-end circuit options...............................................................................................................41
5.3 ZED-F9P minimal design.................................................................................................................... 44
5.4 ZED-F9P antenna bias........................................................................................................................ 44
5.5 Layout......................................................................................................................................................46
5.5.1 Placement......................................................................................................................................46
5.5.2 Package footprint, copper and solder mask.......................................................................... 47
5.6 Layout Guidance................................................................................................................................... 50
5.6.1 RF In trace..................................................................................................................................... 50
5.6.2 Vias for the ground pads........................................................................................................... 52
5.6.3 VCC pads....................................................................................................................................... 52
5.6.4 PCB stackup..................................................................................................................................53
6 Product handling................................................................................................................. 54
6.1 Soldering.................................................................................................................................................54
6.2 Tapes....................................................................................................................................................... 56
6.3 Reels........................................................................................................................................................ 57
6.4 Moisture Sensitivity Levels................................................................................................................ 57
7 Antenna.................................................................................................................................. 59
7.1 Stacked patch antenna.......................................................................................................................59
8 Related documents............................................................................................................ 62
9 Revision history................................................................................................................... 63