ZED-F9R-Integration manual
4.2.1 VCC: Main supply voltage.......................................................................................................... 88
4.2.2 V_BCKP: Backup supply voltage............................................................................................... 88
4.2.3 ZED-F9R power supply...............................................................................................................89
4.3 ZED-F9R minimal design....................................................................................................................89
4.4 WT and DIR interface example..........................................................................................................90
4.5 Antenna...................................................................................................................................................91
4.5.1 Antenna bias.................................................................................................................................93
4.6 EOS/ESD precautions.......................................................................................................................... 95
4.6.1 ESD protection measures.......................................................................................................... 95
4.6.2 EOS precautions...........................................................................................................................96
4.6.3 Safety precautions...................................................................................................................... 96
4.7 Electromagnetic interference on I/O lines.......................................................................................96
4.7.1 General notes on interference issues......................................................................................97
4.7.2 In-band interference mitigation................................................................................................97
4.7.3 Out-of-band interference........................................................................................................... 98
4.8 Layout...................................................................................................................................................... 98
4.8.1 Placement...................................................................................................................................... 98
4.8.2 Thermal management................................................................................................................ 98
4.8.3 Package footprint, copper and paste mask........................................................................... 99
4.8.4 Layout guidance.........................................................................................................................100
4.9 Design guidance................................................................................................................................. 102
4.9.1 General considerations.............................................................................................................102
4.9.2 Backup battery...........................................................................................................................102
4.9.3 RF front-end circuit options....................................................................................................102
4.9.4 Antenna/RF input...................................................................................................................... 103
4.9.5 Ground pads................................................................................................................................104
4.9.6 Schematic design...................................................................................................................... 104
4.9.7 Layout design-in guideline.......................................................................................................104
5 Product handling...............................................................................................................105
5.1 ESD handling precautions................................................................................................................ 105
5.2 Soldering...............................................................................................................................................105
5.3 Tapes.....................................................................................................................................................108
5.4 Reels...................................................................................................................................................... 109
5.5 Moisture sensitivity levels................................................................................................................109
Appendix..................................................................................................................................110
A Glossary................................................................................................................................................... 110
B Reference frames.................................................................................................................................. 111
C RTK configuration procedures with u-center.................................................................................. 111
C.1 Receiver configuration with u-center....................................................................................... 111
Related documents..............................................................................................................117
Revision history.................................................................................................................... 118
UBX-20039643 - R06
Contents Page 5 of 119
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