Clevo W670SZQ User Manual

Disassembly
2 - 12 Removing the System Memory (RAM)
2.Disassembly
Removing the System Memory (RAM)
Figure 8
RAM Module
Removal
a. Remove the screws
from the component
bay cover.
b. Remove the compo-
nent bay cover. The
RAM modules will be
visible at point on
the mainboard.

Contact Warning
Be careful not to touch
the metal pins on the
module’s connecting
edge. Even the cleanest
hands have oils which
can attract particles, and
degrade the module’s
performance.
6
The computer has two memory sockets for 204 pin Small Outline Dual In-line Memory Modules (SO-DIMM) supporting
DDR3L Up to 1600 MHz. The main memory can be expanded up to 16GB. The SO-DIMM modules supported are
1024MB and 2048MB DDRIII Modules. The total memory size is automatically detected by the POST routine once you
turn on your computer.
Memory Upgrade Process

3. Component Bay Cov-
er
•2 Screws
1. Turn off the computer, turn it over, and remove the battery (page 2 - 5).
2. Remove screws
- from the component bay cover (Figure 8a).
3. Lift the component bay cover off the computer case by applying pressure at points & ; if you have prob-
lems using a finger to do this, then use a non-abrasive, non-sharp object (e.g. a coin) to lift the cover up before
removal).
4. The RAM modules will be visible at point on the mainboard (Figure 8b
).
1
2
3
4
5
6
a.
b.
1
2
4
3
3
5
6

Clevo W670SZQ Specifications

General

Brand	Clevo
Model	W670SZQ
Category	Laptop
Language	English