Dell PowerEdge T110 User Manual

Installing System Components 101
5 Connect the control panel cable to the system board.
6 Replace the front bezel. See "Installing the Front Bezel" on page 60.
7 Close the system. See "Closing the System" on page 58.
System Board
Removing the System Board
WARNING: The heat sink can get hot during operation. To avoid burns, ensure
that the system has sufficient time to cool before removing the system board.
CAUTION: Many repairs may only be done by a certified service technician. You
should only perform troubleshooting and simple repairs as authorized in your
product documentation, or as directed by the online or telephone service and
support team. Damage due to servicing that is not authorized by Dell is not covered
by your warranty. Read and follow the safety instructions that came with the
product.
CAUTION: If you are using the Trusted Platform Module (TPM) with an encryption
program, you may be prompted to create a recovery key during system or program
setup. Be sure to create and safely store this recovery key. If you ever need to
replace the system board, you must supply the recovery key when you restart your
system or program before you can access the encrypted data on your hard drive(s).
1 Turn off the system and attached peripherals, and disconnect the system
from the electrical outlet.
2 Open the system. See "Opening the System" on page 57.
3 Remove expansion card stabilizer. See "Removing the Expansion Card
Stabilizer" on page 72.
4 Remove the cooling shroud. See "Removing the Cooling Shroud" on
page 73.
5 Disconnect all cables from the system board.
6 Remove the cooling fan. See "Removing the Cooling Fan" on page 89.
7 Remove all expansion cards and any attached cables. See "Removing an
Expansion Card" on page 76.
8 Remove all memory modules. See "Removing Memory Modules" on
page 82.
Mayzie_HOM.book Page 101 Monday, August 31, 2009 9:33 PM

Dell PowerEdge T110 Specifications

General

Tcase	72.7 °C
Bus type	DMI
Stepping	B1
FSB Parity	No
Processor code	SLBLD
Processor cache	8 MB
Processor cores	4
Processor model	X3450
System bus rate	2.5 GT/s
Processor series	Intel Xeon 3400 Series
Processor socket	LGA 1156 (Socket H)
Processor threads	8
Processor codename	Lynnfield
Processing Die size	296 mm²
Processor frequency	2.66 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	- MHz
Processor boost frequency	3.2 GHz
Processor operating modes	64-bit
ECC supported by processor	Yes
PCI Express configurations	1x16, 2x8, 4x4
Supported instruction sets	SSE4.2
Thermal Design Power (TDP)	95 W
Number of processors installed	1
CPU multiplier (bus/core ratio)	20
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3-SDRAM
Number of Processing Die Transistors	774 M
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	800, 1066, 1333 MHz
Memory bandwidth supported by processor (max)	21 GB/s
Maximum internal memory supported by processor	32 GB
HDD size	3.5 \
Hot-swap	-
HDD capacity	500 GB
HDD interface	Serial ATA
Optical drive type	DVD-ROM
Total storage capacity	1000 GB
Maximum storage capacity	- TB
Number of HDDs installed	2
Internal memory	4 GB
Memory clock speed	1066 MHz
Maximum internal memory	16 GB
Memory layout (slots x size)	2 x 2 GB
Graphics card	G200eW
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
PCI Express slots version	2.0
Power supply	305 W
Compatible operating systems	Microsoft SQL Server 2008 R2, Microsoft Windows Small Business Server 2008, Microsoft Windows Essential Business Server 2008, Microsoft Windows Server 2008 Foundation R2, Microsoft Windows Server 2008 SP2, x86/x64 (x64 Hyper-VTM), Microsoft Windows Server 2008 R2, x64 (Hyper-VTM v2), Microsoft Windows HPC Server 2008, Novell SUSE Linux Enterprise Server, Red Hat Enterprise Linux
Chassis type	Tower
Processor ARK ID	42929
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Depth	463.8 mm
Width	188.64 mm
Height	418.55 mm